McZonk

You should have quite different thermal expansion coefficients on the liquid metal paste and the silicon. Dropping temperatures stiffens the LM-TIM and the different thermal expansion does the rest and leads to failure in the connection (mikro delamination) - On the other hand it is the best way for the 24/7-overclocker to engage better temps, sure... So for Sub0 the long-established GELID should also do a good job on both sides of the IHS.

+ you have to remove the entire mounting system of the socket. Otherwise the pot would not even get in contact with the die, but would rest on the metal frame due to the reduced height of the CPU. Moreover Intel just seems to have raised the forces for the ILM to a minimum of 317 N (maximum at about 600N !). For applying those forces a heavyweight monster-pot giving pressure onto a few square-centimetres of brittle silicon is not the best idea i think. @Roman: talked about the topic at the EOS - few days later it is done Thanks for sharing your experiences with lots of pics! Edit: Since in sience temperature differences are always indicated by using the kelvin-scale. (fyi: 1 degree celsius equals 1 Kelvin)

I have to hold der8auer in high esteem - this was a great event with great organization including an outstanding thrilling competition till the end. Well done, it was great to be there!

As soon as I can open another dewar with der8auer

Full Acknowledge. I think the community should be polled. A quickpoll is a thing of 3 mins and gives you (@massman) a precise estimation where your (!) community stands.

Wish Rev2 would be back! Especially for the bigger teams with lots of members the rev4 seems to be a punch in the gut. So please reconsider your plans.

Full Acknowledge from my side. Pls update the rules!