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Its common knowledge skylake TIM is less than optimal, So I had some Indium Foil left over from some previous playing around.... INNNNDIUMMM, very heavy for just a small thin sheet. Its about 2-3 sheets of paper thick. Nice size piece over the die, it shrinks a little when it melts. Melting point is 157c so went well above that. "A rapid cool down is desired to form a fine grain structure. Slow cooling will form a large grain structure, which typically exhibits poor fatigue resistance. The acceptable cooling range is -0.5 to -6.0C/second (-2.0 to -6.0C/second is ideal)." Tried to maintain this using ln2 to cool it back down. Finished Product is nice and strong which is a good sign. :yepp: End Result, not great, not bad. 4ghz Core 1.35v through XTU on water cooling. Conclusion Will try a couple other ideas. Maybe the foil is to thin or too thick. Could stack 2 layers. Maybe my application is totally wrong. Either way hopefully indium company engineers respond to my email with some ideas. Keep thinking outside the box, one of these times its bound to be a home run.