marcvezina Posted April 17 Share Posted April 17 Hi - I'm considering going sub-zero (Dry Ice first). right now I am using water and Direct-die so I must re-lid my CPU first. In the process. what product should I use between Die and IHS if I'm going sub-zero? Can I still use LM? I know LM is a no-go between pot and IHS, but can I still use it between Die and IHS? Anything better to use when putting back together the CPU? Thanks Quote Link to comment Share on other sites More sharing options...
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