der8auer Posted May 23, 2012 Share Posted May 23, 2012 (edited) PC-Watch published a test few days ago about changing the TIM on Ivy Bridge CPUs. 5-10°C better was the result. But what about LN2? I tested it for you! My test is based on the test of PC-Watch: IHS removal, change the TIM and glue the IHS back on. First I tested the CPU on air to see the changes. To show the full profit I used LN2 aswell. Step 1: Pretesting on air Setup: Intel Core i7-3770K GIGABYTE Z77X-UD3H 4 GB G.Skill 2133 9-10-9-28 Scythe Katana 3 Gelid Extreme der8auer Fusion rev3 For the test on air I clocked the CPU to 4200 MHz at 1,224 Volt and tested for 20 minutes using Prime95 large FFTs. To avoid mistakes I mounted the Scythe Katana 3 times. After 20 mins the maximum temperature reached 83°C. I straight noticed that Core 0 was a lot cooler than the rest. Step 2: IHS removal Ivy CPUs are not soldered anymore as PC-Watch already showed. Using a razorblade the IHS was removed after a couple of minutes. Cleaning the chip I straight noticed that the stock TIM is realy bad quality and already completely dry. That's not how a thermal paste should look after few months. Step 3: Change to GELID Extreme GELID Extreme seemed to be one of the best pastes in the past for extreme overclocking. So I put a little bit in the middle and spread it over the chip. Step 4: Glue the IHS back onThe IHS is not only protecting the DIE - it's also important for the correct mounting. So I decided to glue the IHS back on to the CPU PCB using some normal silicone glue. To get the correct pressure I put the CPU back in the socket and left it there for about 24 hours. Step 5: Retesting on air I used exactly the same settings and also 20 minutes of prime 95 to get a compareable value. The difference in cores 1-3 is about 5 kelvin. But core 0 is much cooler with about 8-9 Kelvin. I'm sure this is one of the reasons why the CPUs clock much higher with only core 0 active. Step 6: Let's get the LN2! I tested this CPU already last week on wPrime to get a comparable result. 6293 MHz were 1024m stable. More voltage did not result in higher clocks. [hwbot=2281599]submission[/hwbot] Now after using the GELID Extreme between IHS and DIE I was able to push the CPU to 6385 MHz. Almost 100 MHz more and ranked 4th here on HWBot [hwbot=2286149]submission[/hwbot] Benching wPrime32m I could push the CPU to 6437 MHz - ranked 2nd global! [hwbot=2286147]submission[/hwbot] Conclusion: I would not recommend this to 24/7 users. 5-9°C more is not worth losing the warranty of a 300 € chip. However extreme overclockers can get some extra MHz changing the thermal paste Note: This is just a shorted and translated version of my original Test at PCGHX Forums: http://extreme.pcgameshardware.de/extreme-kuehlmethoden/218944-extreme-test-wlp-wechseln-bei-ivy-bridge.html Edited May 23, 2012 by der8auer Quote Link to comment Share on other sites More sharing options...
Crew Olesius Posted May 23, 2012 Crew Share Posted May 23, 2012 oops, very good idea bro nice job as always Quote Link to comment Share on other sites More sharing options...
Crew Vivi Posted May 23, 2012 Crew Share Posted May 23, 2012 Thanks dude! You just answered the biggest question, to remove or not remove. I think yes Quote Link to comment Share on other sites More sharing options...
cyclone Posted May 23, 2012 Share Posted May 23, 2012 to remove or not remove. I think yes Nooo! You should have already got a lucky ~7.1-7.3 GHz chip, so extra 500 MHz will kill almost everybody inside the community! Quote Link to comment Share on other sites More sharing options...
Christian Ney Posted May 23, 2012 Share Posted May 23, 2012 Very nice roman, thanks Quote Link to comment Share on other sites More sharing options...
Eeky NoX Posted May 23, 2012 Share Posted May 23, 2012 Yup very nice test But even if it's here on the bot, you should warn about such mod for non extreme guys like most sites does... (warn explicitly ^^) Gives me some ideas btw Thank you Der8auer Quote Link to comment Share on other sites More sharing options...
Splave Posted May 23, 2012 Share Posted May 23, 2012 this is awesome nice work Quote Link to comment Share on other sites More sharing options...
just_nuke_em Posted May 23, 2012 Share Posted May 23, 2012 Good work . So how far off is the die from the IHS? Did you do a mounting test to see how much paste is needed? Quote Link to comment Share on other sites More sharing options...
der8auer Posted May 23, 2012 Author Share Posted May 23, 2012 Thanks guys Good work . So how far off is the die from the IHS? Did you do a mounting test to see how much paste is needed? I don't know whether this is just an issue with my IHS but the inner surface is not as planar as it could be. The edges of the DIE have a little more space to the IHS than the center. That's why I used "quite much" thermal paste. The result shows that it can't be that bad Quote Link to comment Share on other sites More sharing options...
DOM. Posted May 23, 2012 Share Posted May 23, 2012 looks like ill be trying this Quote Link to comment Share on other sites More sharing options...
sin0822 Posted May 24, 2012 Share Posted May 24, 2012 Why kelvin? Quote Link to comment Share on other sites More sharing options...
Hondacity Posted May 24, 2012 Share Posted May 24, 2012 kelvin is just another unit of temperature. nice presentation roman! Quote Link to comment Share on other sites More sharing options...
Massman Posted May 24, 2012 Share Posted May 24, 2012 Using Kelvin makes the entire thing more scientific. Quote Link to comment Share on other sites More sharing options...
xoqolatl Posted May 24, 2012 Share Posted May 24, 2012 Very nice! Now remove it again and try LN2 without IHS Quote Link to comment Share on other sites More sharing options...
Massman Posted May 24, 2012 Share Posted May 24, 2012 Very nice! Now remove it again and try LN2 without IHS I think with IHS is actually the best way because: - the mounting mechanism presses on the IHS to make sure the CPU is perfectly mounted - without IHS, you will need a perfect mount to avoid cracking and optimal contact Imho, the way der8auer did it is the best approach. Quote Link to comment Share on other sites More sharing options...
Christian Ney Posted May 24, 2012 Share Posted May 24, 2012 (edited) Yes, too much pressure on the die will crack it or the system will simply not boot. When I do overclock laptop chips using cold I always use a P4 IHS otherwise the system doesn't boot due to too much pressure on the die Edited May 24, 2012 by Christian Ney Quote Link to comment Share on other sites More sharing options...
McZonk Posted May 24, 2012 Share Posted May 24, 2012 (edited) I think with IHS is actually the best way because: - the mounting mechanism presses on the IHS to make sure the CPU is perfectly mounted - without IHS, you will need a perfect mount to avoid cracking and optimal contact + you have to remove the entire mounting system of the socket. Otherwise the pot would not even get in contact with the die, but would rest on the metal frame due to the reduced height of the CPU. Moreover Intel just seems to have raised the forces for the ILM to a minimum of 317 N (maximum at about 600N !). For applying those forces a heavyweight monster-pot giving pressure onto a few square-centimetres of brittle silicon is not the best idea i think. @Roman: talked about the topic at the EOS - few days later it is done Thanks for sharing your experiences with lots of pics! Edit: Why kelvin? Since in sience temperature differences are always indicated by using the kelvin-scale. (fyi: 1 degree celsius equals 1 Kelvin) Edited May 24, 2012 by McZonk Quote Link to comment Share on other sites More sharing options...
der8auer Posted May 24, 2012 Author Share Posted May 24, 2012 Why kelvin? Using Kelvin makes the entire thing more scientific. Actually telling differences in temperature in Celcius is just wrong. Kelvin is the correct measuring unit for it That's how university changes you @ Chris: Yea I know Just could not resist trying it. Quote Link to comment Share on other sites More sharing options...
SF3D Posted May 24, 2012 Share Posted May 24, 2012 I did same kind of testing this week. Here is the article where you can check the pictures http://www.sf3d.fi/artikkelit/Hy-dytt-k-Core-i7-3770K-l-mp-tahnan-vaihto It had a huge impact to temperatures, which was a bit of a surprise to me. I did not expect that much difference on watercooling. So 7Ghz runs are with replaced thermal paste? Quote Link to comment Share on other sites More sharing options...
djzatorze Posted May 24, 2012 Share Posted May 24, 2012 If we are removing the IHS, we can make it better - I think polishing the inside of IHS to the mirror would decrease the temperature a little more. And maybe Coollaboratory Liquid Pro would be better than Gelid Extreme in such place? Quote Link to comment Share on other sites More sharing options...
Splave Posted May 24, 2012 Share Posted May 24, 2012 Quote Link to comment Share on other sites More sharing options...
riska Posted May 24, 2012 Share Posted May 24, 2012 Here is my chip.. It dropped 10c in idle from 39 to 29c at 4.2ghz havent tested it further.. Quote Link to comment Share on other sites More sharing options...
der8auer Posted May 24, 2012 Author Share Posted May 24, 2012 Here we go Nice work guys! riska it will be interesting how liquid metal performs sub zero. Quote Link to comment Share on other sites More sharing options...
ME4ME Posted May 24, 2012 Share Posted May 24, 2012 Liquid metal is no-go for subzero, when directly in contact with the die. Between metalls, down to -100 it is superior, but then stiffens up en give terrible results. Quote Link to comment Share on other sites More sharing options...
der8auer Posted May 24, 2012 Author Share Posted May 24, 2012 I also thought that. So GELID Extreme should be good enough. Quote Link to comment Share on other sites More sharing options...
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