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PCMark Vantage => 18792 This Intel Core i7 930 is 45nm but the OC range is very good. I just need 1.325V to achieve 4.2GHz. After that, I try to increase the CPU voltage and I can achieve 4.4GHz to run most software at around 1.4V. However, I cannot run all software stable, so I give up this setting. X58 platform OC performance is able to support most applications and conditions. Of course, for users, the speed demand is never enough. Faster and faster DeskTop PC performance is always the never changed goal for IT industry. DDR3 Bandwidth Comparison DDR3 1600 CL7 8-7-21 1T 1.600V Sandra Memory Bandwidth - 26409 MB/s ADIA64 Memory Read - 17585 MB/s MaXXMEM Memory-Copy - 19911 MB/s DDR3 2000 CL10 10-10-30 1T 1.640V Sandra Memory Bandwidth - 30480 MB/s ADIA64 Memory Read - 20361 MB/s MaXXMEM Memory-Copy - 21168 MB/s LGA 1366 is the only 3 channel platform. The DDR3 bandwidth is extremely high. Even though the latest Sandy Bridge LGA 1155 platform optimizes the Memory Controller, these 2 platforms have each own advantages. X58 DDR3 bandwidth is key features and DDR3 OC range is better. In this test, the CORSAIR VENGEANC DDR 1600 CL9 can OC to DDR3 2000 CL10. Even the CL is not as good as DDR3 1600, pulling to higher clock is still good for bandwidth performance. Temperature Enter to Desktop - 37~43 CPU Full Speed - 66~76 Intel Burn Test v2.4，Stress Level Maximum CPU OC voltage is low, so the temperature is lower as well. This is a good result. In full speed, the temperature is around 66~76. If you put all system into case and make good air flow, it will increase 5~8 maximum. For long time usage, the system is able to be stable Power Consumption Enter to Desktop - 158W CPU Full Speed - 304W Intel Burn Test v2.4，Stress Level Maximum OCCT POWER SUPPLY Mode - 525W The VGA is nVIDIA latest mid-end GTX 560 Ti. After OC, the power consumption as entering to Desktop is still acceptable. In 4.2GHz/4Cores full speed condition, it’s also just around 300W. If you use OCCT to make CPU/VGA be full load, the total power consumption is going to 525W. Normally, the PC power consumption is directly proportional. I recommend 600W Power Supply for this system. 3D Performance Test msi N560GTX-Ti Twin Frozr II default is GPU 880/2100 3DMark Vantage => P23278 StreetFighter IV Benchmark 1920 X 1080 => 289.56 FPS

Memory Setup Page Advanced DDR3 parameters setup Voltage Page Load-Line Calibration Standard/Level1/Level2 CPU Vcore 0.50000~1.90000V QPI/Vtt Voltage 1.120~2.000V CPU PLL 1.300~2.520V ICH Core 0.920~2.380V DRAM Voltage 1.300~2.600V PC Health Status During OC, besides CPU and DDR3 quality, the voltage tuning is also very important. In above G1.Assassin setup screen, QPI/Vtt Voltage item is the key to pull high CPU clock. This i7-930 CPU quality is not bad, in 200/1600 ratio, I don’t need to adjust QPI/Vtt Voltage. If you want to run stable at 200/2000 ratio, the proper voltage is the key factor to OC X58 chipset. System Configuration CPU: Intel Core i7-930 MB: GIGABYTE G1.Assassin DRAM: CORSAIR VENGEANCE CMZ12GX3M3A1600C9 VGA: msi N560GTX-Ti Twin Frozr II HD: Intel X25-V 40GB RAID 0 POWER: be quiet! STRAIGHT POWER GOLDEN 550W Cooler: Mega Shadow Deluxe Edition OS: Windows7 Ultimate 64bit OC Performance CPU 200 X 21 => 4199.8MHz 1.325V DDR3 1600 CL7 8-7-21 1T 1.600V Hyper PI 32M X8 => 13m 55.912s CPUMARK 99 => 660 Nuclearus Multi Core => 28279 Fritz Chess Benchmark => 32.02/15368 CrystalMark 2004R3 => 313604 CINEBENCH R11.5 CPU => 7.23 pts CPU(Single Core) => 1.47 pts Windows Experience Index - CPU 7.7

IO 4 X USB 2.0(black) 4 X USB 3.0(blue) 1 X RJ-45 LAN 1 X S/PDIF Optical/Coaxial output Creative Sound Blaster X-Fi Audio Processor, 20K2 Built-in 128MB Memory cache for 20K2. In my impression, this design is for Creative high-end audio card only. Nichicon MUSE ES(green) and MW(yellow) Bi-Polarized audio capacitors. You can see the intention in audio design to get the best audio quality. This is the first time I saw such high end audio chip, capacitors and cache design in MB. I have very high expectation for the audio quality. Of course, this kind of design and other brands X-FI audio card quality must be made real comparison to see the difference. LAN Chip is one more G1-Killer important features. It uses Killer E2100 chip, also called NPU. Besides the past CPU and GPU, now you also can see NPU. You can feel how fast the computer hardware technology improvement. It built-in 1GB DDR2 to process the network traffic control. It helps offload network traffic from the CPU. Another feature is Game Networking, DNA, technology. It offloads gaming data directly to the NPU to deliver tremendous speed benefits. The complete new design thermal module is based on bullet and cartridge, called Locked and Loaded Heatpipe Design . The Upper-Mid and Left are VRM heatpipe. Lower is X58 chipset heatsink and the 5 green LEDs are glowing after power on. This SB ICH10R heatsink is very special Visual effect. The outlook is copy cartridge with one copper bullet. It’s really eye catching. Also the big heatsink, this thermal solution is both for good looking and performance. Boot Screen BIOS Main Page Main BIOS Tuning Menu, called M.I.T. It displays BIOS version, CPU/DRAM clock, DDR3 capacity, CPU temperature and CPU/DRAM voltage info. You can adjust CPU ratio, clock and DDR3 multiplier. The pic is CPU 200Mhz/DDR3 1600 set up screen. CPU Related Technology Items C1E is for power saving. Intel Turbo Boost is contrary with C1E. The CPU can boost speed during high load mode.

I still remember Intel launched the 1st Core i7 platform in Nov 2008 to depart from Core 2 Duo structure. The 1st Core i7 chipset is X58 and CPU socket is LGA 1366 which position in extreme segment. In mid 2009, Intel launched same structure with LGA 1156 socket which is mid to high end market. Early this year, the 2nd generation Core i structure, LGA 1155, launched and the position is overlap with LGA 1156. In the market, there are 3 platforms for Core i7 structure, but the most high-end is still X58. As per the internet news, LGA 1366 product line will be available till end of 2011, and the life cycle will be over 3 years. The existing time for the platform is catching up LGA 775. GIGABYTE latest G1-Killer X58 series has 3 models, G1.Sniper, G1.Guerrilla and G1.Assassin Even though this is late X58 products, if you use Intel latest Core i7-990X, it’s still the most top LGA 1366 platform. Of course the cost is also high end market level. G1.Assassin is the most high-end model of G1-Killer series. The form factor is XL-ATX, 34.5cm x 26.3cm. The XL-ATX Case is still rare in the market. The pantone is black and green. This is the first time for GIGABYTE MB. There are 5 Smart Fan headers. The users can control the chassis temperature more efficiently. G1-Killer is also the first GIGABYTE Gaming series MB. In the past, many brands used to launch gaming series high end boards. No matter components usage and features, G1.Assassin is really fit for Gaming. You will see the detail as following my further introduction. Accessories Product manual, Software manual, Driver CD, I/O shield, SATA cables and CrossFireX/SLI bridge G1-Killer poster and stickers Front Access Control Panel It offers 2 USB 3.0 and 1 Power eSATA Left side Quick Boost button can switch user to OC mode to enhance the system performance. Lower-Left Corner 2 X PCI-E X16 support X16 bandwidth 2 X PCI-E X16 support X8 bandwidth The PCI-E can support up to 4-Way ATI CrossFireX and 3-Way NVIDIA SLI 2 X PCI-E X1 1 X PCI Bigfoot Killer E2100 LAN chip Creative CA20K2 Audio chip supports Dolby Digital Live, DTS Connect, X-Fi Xtreme Fidelity and EAX Advanced HD 5.0 technology. It supports up to 7.1 channel and High Definition Audio. Design in Taipei Lower-Right Corner 6 X black SATAII, provided by ICH10R, SATA2 and support RAID 0, RAID 1, RAID 5 and RAID 10 2 X white SATAIII, provided by Marvell 9182, SATA3 and support RAID 0, RAID 1 2 X 16 Mbit flash, Dual BIOS, dual protection. Upper-Right Corner 6 X DIMM DDR3 support 800/1066/1333/2200 and max capacity is 24GB DDR3 has 2 phase PWM and next is 24-PIN power connector Upper-Left Corner LGA 1366 CPU Socket, CPU metal cover uses plating one G1.Assassin uses 16 phases PWM and support dual 8 phases power switching mode. It needs GIGAYTE Dynamic Energy Saving (DES2) software to enable the dual power switching function. Back is two 8 PIN design for enhancing system stability under high loading condition

Of the many cases in which ITX motherboards can be installed, sometimes design specifications call for installation of 2.5-inch HDDs in order to keep the space compact If you need larger capacity, you can choose a 2.5-inch HDD for notebooks. If you need performance, SSD immediately comes to mind Currently on the market there are two different directions in the choice of storage hardware In those platforms equipped with CORSAIR FORCE SERIES F60, we hope to make the ITX platform achieve better transmission performance When the ATTO DISK Benchmark exceeds 16k, performance is good, and the maximum read speed is 281.9 MB/s, while the maximum write speed is 264.4 MB/s When the EVEREST File Benchmark exceeds 1024k in these tests, performance begins to approach or exceed 250-275 MB/s CrystalDiskMark 4K QD32 Read -97.57 MB/s Write - 60.34 MB/s AS SSD Benchmark Seq Read - 201.18 MB/s Write - 44.04 MB/s 4K-64Thrd Read - 100.32 MB/s Write - 47.20 MB/s For the ECS H67H2-I using the latest H67 chipset, data transfer performance is quite good The CORSAIR FORCE F60’s maximum specification is 285/275 MB/s, and maximum performance is almost certain to be achieved with some test software The 4K performance is quite good, and for users’ small file performance needs, the selection of the SSD with faster 4K read speed is a vital factor Video playback test Startup of Inception, a Blu-ray movie on hand. All rights are reserved by the publisher of the above video. Start menu Software used -- PowerDVD 10 Resolution of 1920 x 1080 At this point, CPU usage is very low, about 0-2% Video process 2-6% CPU usage Playing video files directly Video resolution of 1280 x 720 0-5% CPU utilization Video resolution of 1440 x 1080 5-12% CPU utilization The second generation Core i3 has excellent multimedia performance, and in video playback tests, CPU utilization seldom exceeds 15% Under playback conditions for most video formats, CPU utilization in general is only 1-12% With regard to the ITX architecture, performance is very high, and for use as a HTPC it is more than sufficient by several times Although the performance of an HTPC needs at least smooth video playing, we are certain that consumers will never be dissatisfied with performance Video conversion is a new technology of Sandy Bridge -- one of its main features The following is a test of Intel's new Quick Sync Video technology MediaEspresso test of the time required for video conversion by the built-in GPU DVD file VTS_01_1.VOB, size capacity of 1023MB, 2500K converted into an MP4 file Intel HD Graphics HD2000 Starting Intel Quick Sync Video (better quality) 10 minutes 39 seconds For the Intel Quick Sync Video technology to speed up video conversion, a prerequisite is the need to run the built-in GPU HD2000/HD3000 before this feature can be used. We have previously compared Intel Quick Sync Video with nVIDIA and CUDA, two video conversion technologies. The speed comparison shows Quick Sync Video has the advantage, and for users with this application in mind, this should be a significant benefit. ECS H67H2-I Advantages 1. High-end Mini ITX specification H67 product with abundant accessories 2. All solid capacitors, eSATA, USB 3.0/eSATA and other components 3. Built-in Bluetooth capability, support for v2.1 + EDR technology, with a Mini PCI-E for extended use also provided 4. BIOS allows overclocking of the GPU so that 3D performance achieves a higher standard 5. With regard to the performance of the i3 CPU that is part of Sandy Bridge, temperature and power achieve good performance Shortcomings 1. We recommend that a BIOS C1E option be created for users to freely choose performance modes 2. If an antenna that’s necessary for the wireless network can be added, it will be an improent vem Performance ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ Components ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ Specifications ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ Appearance ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ Price to performance ★ ★ ★ ★ ★ ★ ★ ★★ ☆ In the past two years, ECS has performed well in the area of small Mini ITX motherboards The launch of the H55H-I in the earlier generation LGA 1156 architecture was very well positioned in the market in terms of price to performance This time around, the H67H2-I added Bluetooth capabilities and a Mini PCI-E slot for wireless networks to the specifications, making the HTPC platform an even better proposition. The price is about NT$3,450, or about US$120 With the H67 chipset, the price makes the H67 a worthy entry-level solution, and therefore we have very high marks for the price to performance of this product. Some time ago I shared my views on Mini ITX products based on the AMD Fusion architecture which were even a bit cheaper than this platform currently reviewed However, the AMD architecture is equivalent to the Intel Atom CPU series in terms of performance, and we can only say that the assembled HTPC's performance meets basic needs Intel’s new generation H67/H61 chipsets in the Mini ITX product line achieve quite satisfactory performance Of course, Sandy Bridge ITX products should only be considered by consumers with a certain budget range In this review of the ECS H67H2-I, I’ve found many areas where performance has been above the standard, I hope this article can be of use to ITX enthusiasts as a reference before you buy This review also post in my blog WIND3C Welcome 3C lovers to visit and advise. Thanks

CPU full speed - 63W Standby / full speed power consumption is 25W/63W, a significant reduction compared with the previously tested i3-540 and H55 at 52W/83W This shows that all LGA1155 second-generation Core i-series platforms made with the same 32nm manufacturing process have lower power consumption and higher performance For users who care about power consumption and temperature, these two aspects make the performance advantages of the Sandy Bridge stand out even more DDR3 bandwidth DDR3 1064.4 CL7 7-7-20 1T ADIA64 Memory Read - 13912 MB/s Sandra Memory Bandwidth - 14146 MB/s MaXXMEM Memory-Copy -15356 MB/s Because the previous LGA 1156 architecture uses the built-in GPU, the DDR3 suffers bandwidth limitations Starting with the new generation LGA 1155 i3, this problem has been fixed, and even if you use the built-in GPU, you can begin to take advantage of high bandwidth DDR3 provided under the new architecture. In the same way, the DDR3 1066 bandwidth of the previous and current two generations will have a greater than 50% improvement If ECS can provide an option in BIOS to switch freely between 1066/1333, higher bandwidth performance should be possible Intel HD Graphics HD2000 Benchmark Test Default clock 1100MHz 3DMark Vantage => P1041 StreetFighter IV Benchmark 1280 X 720 => 26.53 FPS DEVIL MAY CRY4 1280 X 720 => 25.25/21.77/28.80/17.80 fps FINAL FANTASY XIV 1280 X 720 => 368 The specifications of the GPU in the i3-2120 are Intel's latest for the HD2000 Compared with the i5-2300 equipped with the HD2000 that was previously tested by windwithme, there is a difference in 3D performance of about 10 to 15% Compared with the 3D performance of the previous generation i3-540, this current generation has clearly made huge progress Although 3D performance is not the main strength of ITX, the performance of the built-in GPU is high, and for general 3D needs in the future, this will certainly be a big help. HD2000 Overclocking 27 X 50 => 1350MHz 3DMark Vantage => P1314 StreetFighter IV Benchmark 1280 X 720 => 31.01 FPS DEVIL MAY CRY4 1280 X 720 => 29.52/24.30/33.54/20.71 fps FINAL FANTASY XIV 1280 X 720 => 434 Overclocked 3D performance can be improved by 17-26%, yet unfortunately, unlike several earlier i5 HD2000’s, overclocking in the 1700-1800MHz range is impossible. But within a small overclocking range, performance gains are not insignificant, so for those web surfers who need performance, this is worth considering However, if a huge increase in 3D performance is necessary, the better choice is to spend more for an additional graphics card

Information on hardware devices in the operating system Atheros wireless network card installed Performance tests CPU 99.8 X 33 => 3293.4MHz C1E Activated DDR3 1064.4 CL7 7-7-20 1T Hyper PI 32M X 4 => 17m 32.908s CPUMARK 99 => 508 Nuclearus Multi Core => 11878 Fritz Chess Benchmark => 13.01/6243 CrystalMark 2004R3 => 190657 CINEBENCH R11.5 CPU => 3.16 pts CPU (Single Core) => 1.31 pts PCMark Vantage => 11922 Windows Experience Index - CPU 7.1 The CPU-Z cannot display the correct voltage, and BIOS must be used to find the correct voltage The situation is the same with the H55H-I generation, which may be related to the design of the special PWM that results in some software errors regarding the voltage information The i3-2120 clock goes up to 3.3GHz, providing a performance improvement of up to 10-20% with the new architecture In many of the above tests, this platform has pretty good test data, and especially in the ITX area, the performance level is high Temperature performance (room temperature about 18 degrees) System Standby - 20-26 CPU full speed - 44-49 Intel Burn Test v2.4, Stress Level Maximum Regarding the temperature of the i3 CPU, the 32nm process has always performed well, and the original thin heat sinks were used in the test Did not exceed 50 degrees at full speed, but of course after installation in the chassis, this will depend on differences in the environment or system thermal convection, raising the temperature by about 5 to 8 degrees Power Consumption Test System Standby - 25W

The top part of the H67 chipset is covered by a black heat sink with a larger surface area for heat dissipation BIOS screen M.I.B III, ECS overclocking technology This page provides adjustable voltage options. DDR3 1T/2T with the current CPU clock / DDR3 capacity / voltage status CPU Voltage +20 to 320mV IMC Voltage +10 to +630 mV DIMM Voltage -800 to +630 mV PCH Voltage 1.05/1.10V ICC options page Provides front side bus (FSB) options: actual tests show it is impossible to boost FSB I hope that later BIOSes can display options here DRAM timing information Intel default GPU overclocking options When overclocking, we recommend that graphics current be set to max The clock is set for a default of 22 at the graphics core ratio limit Each level represents a clock of 50MHz: in the figure, the setting is 27 or 27 x 50 => 1350MH IGD Memory has three options, namely 32/64/128MB For DVMT / FIXED Memory, there are three options: 128/256MB/Maximum PC Health Status In the past, most Mini ITX systems did not emphasize performance or overclocking, so the BIOS used a reduced instruction set With the H67H2-I, the BIOS options are more abundant, but if an option can be added to switch between DDR3 1066/1333, it will be better Test platform CPU: Intel Core i3-2120 MB: ECS H67H2-I DRAM: CORSAIR CMX8GX3M2A1600C9 VGA: Integrated Graphics HDD: CORSAIR Force SSD 60GB POWER: Antec HCG 400W Cooler: Intel installed heat sink OS: Windows7 Ultimate 64bit The CPU is the Core i3 2120 that was just recently introduced in March The product name is the Intel Core i3-2120 with a system clock of 3.3GHz The actual two cores have Hyper-Threading technology with a capacity of up to four threads that is referred to as 2C/4T 32nm process, power 65W, L3 Cache with total of 3MB, as second entry-level LGA 1155 with dual core CPU Lower left corner is Revision D2 version back column Top right is the original heat sink, and for their dual cores CPUs, Intel always uses a non-copper based design For the Sandy Bridge architecture, there are two Core i3 models on the market, namely the i3-2100 and the i3-2120 The main difference between the two models is the clock, which for the 2100 is 3.1GHz, and for the 2120, it's 3.3GHz For consumers, we feel the i3-2100 provides better price to performance value

Before in the desktop PC consumer market, it was generally difficult to buy ITX MB products The few ITX MB products on the market were expensive and suffered the limitations of notebook CPUs and DRAMs In the past two years, there has been a clear expansion in the ITX market that reflects its increasing popularity with consumers Starting with the previous generation P55/H55 chipset, a number of notebook brands invested in ITX product development and sales in order to offer more ITX MB products and let consumers set up HTPCs more easily while also allowing them to use the CPU and DDR3 specifications of desktops, thereby dropping the cost of an ITX system a lot After Intel launched the new generation Sandy Bridge this year, we've heard on the web about a lot of motherboard companies that have plans for ITX products In general, it seems they will use the H67 or H61 chipsets to reach price points comparable to Micro ATX specifications ITX has given rise to new market trends, and the new PC architecture will help boost ITX PC performance gains and allow Intel to significantly raise its visibility in the ITX market. At this point, let's return to the star of the show, the H67H2-I launched by ECS that uses the high-end H67 chipset in the Sandy Bridge architecture During the LGA 1156 era, ECS also launched the H55H-I with an H55 chipset, which shows the amount of attention this brand has paid to the ITX market. To start, take a look at the H67H2-I overall and size specifications for the Mini ITX at 17 x 17cm A comparison of the differences in the previous H55H-I generation The H67H2-I has changed to a black PCB with gray DIMM / PCI-E slots that give a stronger contrast to the appearance Another addition is the overall use of commonly seen solid capacitor materials that effectively increase the durability of the product Included accessories Manual, quick installation guide, IO bezel, SATA cable and driver software CD Includes low profile bezel meeting more general specifications allowing users to install a wireless network antenna Bottom of motherboard LGA 1155 CPU socket, LOTES brand name 1 X PCI-E Gen2.0 X16 Realtek RTL8111E LAN chip Realtek ALC892 audio chip and a codec supporting 8-channel audio and High Definition Right section of motherboard 2 x DIMM DDR3, supporting 1066/1333, DDR3 maximum capacity of 16GB. On side of board, a 24-PIN power input Top of motherboard 2 x white SATA, H67 chip installed, SATA2 specifications 2 x gray SATA, H67 chip installed, SATA3 specifications IO D-SUB/DVI/HDMI 6 x USB 2.0 (red / black) 2 x USB 3.0 (blue) 1 x RJ-45 network holes 1 x Bluetooth module 1 x eSATA CPU using four types of power input Based on Sandy Bridge's low power consumption, the maximum should be 2500K/2600K Sticker on top part indicates device meets Bluetooth specifications Another feature of the H67H2-I is the built-in Mini PCI-E slot Interface allows expansion with hardware meeting the same specifications such as mSATA SSD, TV cards or ordinary wireless network cards

At full speed of CPU: - 105W There is also a slight lag between the power consumption after overclocking and the default value. It can be known that CPU overclocking has little effect on the temperature and power consumption. Intel HD Graphics HD2000 performance test Preset frequency 3DMark Vantage => P1251 StreetFighter IV Benchmark 1280 X 720 => 30.65 FPS FINAL FANTASY XIV 1280 X 720 => 408 By comparing the built-in 2300K HD2000 GPU with the previously tested 2500K HD3000 GPU, there is a lag of about 30%~40% in its 3D performance. There is no big difference between the two in this aspect when compared in the Game. For example, the performances of 2300K HD2000 GPU and 2500K HD3000 GPU in StreetFighter IV are 30FPS and 40FPS, respectively. HD2000 overclocking frequency 37 X 50 =>1850MHz 3DMark Vantage => P2078 StreetFighter IV Benchmark 1280 X 720 => 44.61 FPS FINAL FANTASY XIV 1280 X 720 => 623 After the overclocking of HD2000, there is a performance increase of over 50% in the three kinds of Game Benchmark softwares mentioned above. Sandy Bridge’s GPU overclocking scope is greatly increased. Similarly, the preset performance is also 2~3 times higher than the last generation of i3-540 integrated with H55. The great leap in 3D performance definitely creates an impact on the M-ATX/ITX market for built-in GPU, but this also depends on how the competitor -- AMD respond with new chipsets in the future. BIOSTAR TH67XE Advantages 1. H67XE is much cheaper compared to the H67 products of other brands; 2. Built-in Power/Reset button, 7-phase PWM power supply design, USB 3.0/eSATA and other extended interfaces 3. BIOS provides CPU external frequency/GPU frequency/DDR3 frequency setting, as well as diverse voltage options. 4. The Sandy Bridge platform has low temperature and low power consumption. It also has more DDR3/GPU performance than the previous platform. Disadvantages 1. BIOSTAR has no channels in Taiwan at present; 2. Segmental adjustment is required when adjusting the external frequency of the CPU from 100MHz to 107MHz. Performance ratio: ★★★★★★★★☆ Material ratio: ★★★★★★★★☆☆ Specification ratio: ★★★★★★★★☆☆ Appearance ratio: ★★★★★★★★☆☆ C/P ratio: ★★★★★★★★★☆ Intel Core i5-2300 is sold at about NT$5,600 in Taiwan, which is equivalent to around US$ 190. Core i5-2400 is about NT$5,750, which is equivalent to around US$195. There is a small price difference between these two CPUs. Specifically, i5-2300 has 2.8GHz and i5-2400 has 3.1GHz; the C/P of 2400 seems to be much higher. Unless there is a price reduction of 2300 in the future so as to create a price difference between the two, customers may opt for the 2400 CPU. The tested TH67XE still has the advantages emphasized by BIOSTAR, which include effciency, overclocking and affordability. Moreover, its material and specification are much better than the low level H67, but its price is lower than the middle and high level H67 of other brands. The C/P ratio of BIOSTAR is indeed attractive to consumers given its price. It also provides an overvalued choice for consumers with limited budget. This article mainly shares information on the performance of i5-2300 integrated with H67, and its affordability in many aspects. It also provides the HD2000 3D performance test. To those who still have some questions about the 3D performance of HD2000/HD3000, I suggest you read the previous tests related to 2500K which I have uploaded. Thank you for reading this article:) This review also post in my blog WIND3C Welcome 3C lovers to visit and advise. Thanks

DDR3 1426.8 CL7 7-7-20 1T ADIA64 Memory Read - 17417 MB/s Sandra Memory Bandwidth - 18980 MB/s MaXXMEM Memory-Copy -18573 MB/s The built-in CPU of previous LGA 1156 Core i3/i5 integrated with H55, may not be able to run the DDR3 bandwidth. However, the new generation LGA 1155 may have addressed this problem with its built-in CPU that begins to retain the architecture performance. With regard to the Core i platform of Intel built-in GPU, its DRAM bandwidth performance is no longer as good as that of Core 2 Duo. There is an improvement of over 50% in the bandwidth of DDR3 1333. Overclocking performance CPU 107 X 28 =>2996MHz Start up Turbo Boost and C1E DDR3 1426.8 CL7 7-7-20 1T Hyper PI 32M X4 => 11m 25.356s CPUMARK 99 => 509 Nuclearus Multi Core => 17939 Fritz Chess Benchmark => 19.63/9424 CrystalMark 2004R3 => 221505 CINEBENCH R11.5 CPU => 4.92 pts CPU(Single Core) => 1.33 pts PCMark Vantage => 16264 Windows experience index - CPU 7.4 There are more limitations for Sandy Bridge in CPU overclocking than ever before. If only the CPU external frequency is adjusted, then the CPU can operate stably within a range of 104~107MHz. In terms of overclocking and multiplication, there are only 2500K/2600K integrated with P67 chipset that can realize a drastic overclocking. As to H67, only a small overclocking of the external frequency can be adjusted, and the whole frequency after the external frequency’s change to 107MHz, will increase from 2.8 to almost 3GHz. Temperature performance (room temperature is about 18℃) During system standby: - 25~33 At full speed of CPU: - 61~64 Intel Burn Test v2.4，Stress Level Maximum Since the overclocking is only about 7%, there is no big difference in the temperature. By comparing the default values, the temperature difference during system standby is about 3℃ and this is just about 4℃ at full speed of the CPU. Power consumption test During system standby: - 37W

Nuclearus Multi Core => 15988 Fritz Chess Benchmark => 18.13/8700 CrystalMark 2004R3 => 208508 CINEBENCH R11.5 CPU => 4.63 pts CPU(Single Core) => 1.25 pts PCMark Vantage => 14528 Windows Experience Index - CPU 7.4 Core i5-2300 is a version of Sandy Bridge 4Cores CPU with the lowest frequency and poorest specification. However, because of the enhanced performance of the new architecture and the 4C4T core architecture, it has earned a good performance score in the software testing. With a default value of 2.8GHz, plus a Turbo Boost 2.0 frequency that can reach up to 3.1GHz, it has many applications. Temperature performance(room temperature is about 18℃) During system standby: - 23~30 At full speed of CPU: - 58~60 Intel Burn Test v2.4，Stress Level Maximum The performance of the original Intel radiator is relatively good At full speed, the temperature is even a little lower than the previous temperature as the 2500K original radiator is tested. The 5~10 ℃ difference might be caused by the high or low frequency. For better temperature performance, there is a need to spend more money for a replacement with a higher level CPU radiator. Power consumption test During system standby: - 35W At full speed of CPU: - 100W The power consumption performance is also one of the characteristics of Sandy Bridge after it changes its 4Cores CPU process into 32nm. With the integration of the C1E energy-conserving technology, power consumption can be reduced more effectively and the CPU’s power consumption at standby and full speed modes is greatly reduced compared to the previous 45nm CPU. Comparison of DDR3 bandwidths DDR3 1331.2 CL7 7-7-20 1T ADIA64 Memory Read - 16142 MB/s Sandra Memory Bandwidth - 17674 MB/s MaXXMEM Memory-Copy -17341 MB/s

IO VGA/DVI/HDMI/Display Port 4 X USB 2.0(Red/Black) 2 X USB 3.0(Blue) 1 X eSATA/USB 2.0 (share the red) 1 X IEEE 1394a 1 X RJ-45 (network connector) 1 X S/PDIF Out Port The power pack is covered with heat sinks. Both the appearance and the texture are quite good; the design of the radiating area is also considered. The heat sink of the H67 chipset also adopts the same material and design BIOS Homepage O.N.E Adjustment page CPU Clock 100 is adjusted to 107MHz Graphics Core Ratio Limit is the overclocking option of GPU DDR3 DRAM Multiplier 10.66/13.33 Voltage options There are four CPU VCore Mode options, including SPEC Volgate/Auto/Offset Mode/Fixed Mode CPU VCore Offset +0.010~+0.520V CPU VCore Fixed 1.000~1.790V There are four IGD VCore Mode options, including SPEC Volgate/Auto/Offset Mode/Fixed Mode IGD VCore Offset +0.010~+0.520V IGD VCore Fixed 1.000~1.520V DRAM Voltage 1.300~2.200V IGD Memory can select the capacity of the shared main storgae that is required by the built-in GPU. CPU Configuration Enable and disable some relevant functions of the CPU Common HT technology or the function of selecting the use of a few cores PC Health Status The built-in monitoring chip of MB can be used to know the current status of various primary voltages or the temperature conditions inside the system Above is the BIOS settings of windwithme in the BIOSTAR TH67XE overclocking. H67 chipset is characterized by All In One positioning, thus overclocking only requires CPU external frequency/GPU frequency/DDR3 frequency. Test platform CPU: Intel Core i5-2300 MB: BIOSTAR TH67XE DRAM: CORSAIR CMX8GX3M2A1600C9 VGA: Integrated Graphics HDD: Intel X25-V 40GB RAID 0 POWER: CORSAIR CX430W Cooler: Intel original radiator OS: Windows7 Ultimate 64bit Preset performance CPU 99.8 X 28 =>2794.4MHz Start Turbo Boost and C1E DDR3 1331.2 CL7 7-7-20 1T Hyper PI 32M X4 => 12m 16.446s CPUMARK 99 => 476

In the beginning of 2011, Intel released its latest platform with LGA 1155 version, also known as Sandy Bridge architecture. The release modes of its processor and chipset products are much similar to the last generation of LGA 1156. What’s more, Sandy Bridge’s process technology has been improved comprehensively up to 32nm, and its efficiencies have also been enhanced in many aspects. Each CPU carries a built-in HD2000 or HD3000, which is another feature of the new platform. It is the first wave to release several 4Cores 32nm versions for CPUs; the series name is Core i5/Core i7. Chipsets with built-in display and output function include H67/H61 types, and the major difference lies in the specification and ability to support Riad. H67 is an advanced chipset that was released in the beginning of January this year, but the H61 entry level positioning will be made available after March. Currently, the leading CPU is 2300, a version with the lowest price of Core i5. Product model: Intel Core i5-2300; Frequency: 2.8GHz It supports the latest generation of Turbo Boost 2.0 technology and can reach a performance of up to 3.1GHz. It has 4 Cores but does not adopt the Hyper-Threading technology. It can reach a maximum of 4 threads, which is called 4C/4T. It has a 32nm process and power consumption of 95W, as well as a L3 Cache of 6MB, and easy-to-use 4Cores CPU in LGA 1155 products. Intel 4Cores CPU integrates with the copper heat sink which has its bottom attached to some solid thermal conductive adhesive. I personally suggest coating some thermal grease onto the CPU before installing it because this can reduce the temperature efficiently. MB adopts BIOSTAR TH67XE, its XE series is a high-level product line and its price isn’t as high as that of other brands. The price of this product in the U.S. is about US$105, which is equivalent to around NT$3,100. Compared to other H67 products in Taiwan which cost NT$4,000~5,000 or higher, the price of BIOSTAR H67 is much reasonable. In terms of color, the black PCB is common while other PCI-E or DIMMs have red and white colors. These are much more conspicuous than the previous yellow or green colors. Attached accessories Product manual, IO files, SATA wires, driver software and disc Lower left of mother board 2 X PCI-E 2.0 X16; Bandwidth: X16+X1 1 X PCI-E X1 1 X PCI Realtek RTL8111E network chip Realtek ALC892 audio chip supports 8+2 sound channels and Blu-Ray Codec technology. Lower right of mother board 3 X red SATAII, provision of H67 chip, SATA2 specification, supports RAID 0， RAID 1，RAID 5 and RAID 10 2 X white SATAIII，provision of H67chip，SATA3 specification，supports RAID 0， RAID 1，RAID 5 and RAID 10 Power and Reset buttons Upper right of mother board 4 X DIMM DDR3，supports 1066/1333 and a maximum capacity of DDR3 of 16GB There is a 24-PIN power input end at the side Upper left of mother board TH67XE adopts a 7-phase power supply design and there is a 8Pin power input end at the upper side

StreetFighter IV Benchmark 1280 X 720 => 33.23 FPS DEVIL MAY CRY4 1280 X 720 => 29.10/23.52/34.55/20.80 fps FINAL FANTASY XIV 1280 X 720 => 558 OC GPU from 500MHz to 760MH, the 3D performance only increases 10%. According to source, AMD will lock GPU clock in following revision. It’s a pity news for all users. You can know AMD Radeon HD6310 OC is not big help to performance. CPU is another factor to impact the performance. Vedio Decoding Test I use 2 original video to test. 1 is blue-ray, Inception, and the other is DVD, Taiwan Puppet Show. The video copyright is owned by the published company. Openning Menu Software is PowerDVD 10 Resolution is 1920 X 1080 CPU utilization rate is only 1~5%. Playing Video CPU utilized rate is 18~29% DVD resolution is 720 X 480 Software is Windows Media Player CPU utilization rate is only 1~8%. Play Video File Directly Resolution is 1280 X 720 CPU utilized rate is 38~83% and most time is 40~50% Video resolution is 1440 X 1080 CPU utilized rate is 40~94% and most time is 45~62% If using playing video, no matter DVD or BD, the utilization rate is very good. If play video file directly, the CPU utilization rate rise a lot. I don’t know it’s caused by format decoding or transfer rate issue. But final result is playing smoothly. Video decoding is a great strength of AMD Fusion. GIGABYTE E350N-USB3 Good 1.GIGABYTE Ultra Durable 3 design. 2oz copper PCB, 100% Japanese made capacitors and Ferrite core choke. 2.Active cooler and support SATA3 and USB 3.0 latest spec. 3.Built-in AMD Radeon HD 6310 GPU 3D performance is improved a lot and it can play BD/DVD very smoothly. 4.AMD latest 40nm CPU Bad 1.It could also add on wifi card, but the price will go higher. 2.CPU OC range is less and GPU OC doesn’t improve performance much. Performance ★★★★★★☆☆☆☆ Components ★★★★★★★★☆☆ Specification ★★★★★★★☆☆☆ Outlook ★★★★★★★★☆☆ C/P Value ★★★★★★★★☆☆ Currently, GIGABYTE E350N-USB3 market price is 4700NTD, around 160USD. Even though it’s ITX, but BIOS menu and components are same level as own M-ATX/ATX. Plus AMD Radeon HD 6310 GPU, the 3D performance or video decoding are increasing a lot. AMD dual core E-350 CPU is same level as Intel Atom, the performance is only so so. For components, spec and performance, E350N-USB3 C/P value is quite good in AMD ITX market. For AMD market, AMD Fusion provides one more fair price option for ITX or NetBook market. This should be the main target for Fusion structure. Now, many MB makers all launch their related ITX product. From the price point, if your HTPC budget is 7000NTD, you can choose Intel 55/H61 ITX MB with i3 CPU. If you don’t fix in IXT, your budget can have Micro ATX 880G and AMD X2 CPU. Of course you need bigger chassis. Due to HTPC market is growing, in the future, users can see more ITX MB in the market and it can reduce the PC dimension. I provide 2 more option for mid-end performance combo. Users can pick the right option by yourself. Later on, if I got time, I will share Toshiba NB520 latest NetBook. It uses Intel Atom N550 1.5GHz and I can make the comparion with AMD Fusion. This review also post in my blog WIND3C Welcome 3C lovers to visit and advise. Thanks

PCMark Vantage => 4094 E-350 CPU FSB rise from 100 to 107MHz. The CPU performance increase about 7%. Adding on OC GPU clock, some media benchmark scores are more than 7%. AMD Fusion OC range is not much and no need to adjust too many BIOS items. However, less OC is still better than none. Temperature (Room is 18℃) System Standby - 48~49 CPU Full Speed - 66 Intel Burn Test v2.4，Stress Level Maximum No matter OC or not, the temperature is the same. Even it’s lower 1~2℃ due to room temperature. The main reason is still the OC range is small. DRAM Performance Test ADIA64 Memory Read - 3936 MB/s Sandra Memory Bandwidth - 3900 MB/s MaXXMEM Memory-Copy - 4331 MB/s DDR3 1333 CL6 6-6-18 1T DDR3 1426 CL6 6-6-18 1T ADIA64 Memory Read - 4232 MB/s Sandra Memory Bandwidth - 4313 MB/s MaXXMEM Memory-Copy - 4629 MB/s DDR3 performance increase 6~8% after OC. Also AMD Fusion only supports single channel. Users cannot expect too much the memory performance. The right way should be increasing the DDR3 capacity. GPU Test Default 500MHz 3DMARK VANTAGE => P800 CPU SCORE => 2057 GPU SCORE => 665 StreetFighter IV Benchmark 1280 X 720 => 30.07 FPS DEVIL MAY CRY4 1280 X 720 => 25.65/21.33/30.04/19.75 fps FINAL FANTASY XIV 1280 X 720 => 502 AMD Fusion structure is built-in latest Radeon HD 6310 GPU, supports DirectX 11. Comparing to own 890GX chipset, HD4290 GPU, it’s still higher. In 3D performance, E350 enhance a lot. Maybe it dues to AMD suffer vert hard push from Intel Sandy Bridge built-in GPU？ OC to 760MHz 3DMARK VANTAGE => P891 CPU SCORE => 2187 GPU SCORE => 744

CPU Full Speed - 34W Intel Burn Test v2.4，Stress Level Maximum OCCT POWER SUPPLY Mode - 41W As per 40nm, standby power consumption is pretty good in PC. If it’s in NB, the value is too high. When CPU full speed is 34W and CPU/GPU simultaneous operation is 41W. The difference is only 7W, not much. Main BIOS Tuning Menu called M.I.T. CPU Host Clock 100~120 Memory Clock X5.33/X6.66 Voltage Items DDR3 Voltage 1.200~2.100V FCH Voltage 1.100~1.600V PCIe PLL Voltage 1.800~2.200V CPU NB VID Control -0.600~+0.600V CPU Voltage Control -0.600~+0.600V Built-in AMD Radeon HD 6310 GPU Items UMA Frame Buffer Size 256/512/1024MB VGA Core Clock 300~2000MHz Advanced DDR3 Setup Page The setting below is DDR3 1333 CL6 6-6-18 1T PC Health Status GIGABYTE E350N-USB3 BIOS still provide very rich items. It doesn’t simplify BIOS menu as it’s ITX MB or AMD Fusion OC capability. Since then, user can adjust by your free mind and also OC some portion. OC Performance Test CPU 107 X 16 => 1712.3MHz DDR3 1426 CL6 6-6-18 1T GPU 760MHz Hyper PI 32M X2 => 38m 01.798s CPUMARK 99 => 136 Nuclearus Multi Core => 3356 Fritz Chess Benchmark => 3.57/1711 CrystalMark 2004R3 => 86639 CINEBENCH R11.5 CPU => 0.67 pts CPU(Single Core) => 0.35 pts

3 phase PWM is enough for this low power consumption platform Test Configuration CPU: AMD E-350 MB: GIGABYTE GA-E350N-USB3 DRAM: CORSAIR CMX8GX3M2A1600C9 VGA: AMD Radeon HD 6310 HD: CORSAIR Force SSD 60GB POWER: Antec HCG 400W Cooler: GIGABYTE built-in Cooler OS: Windows7 Ultimate 64bit Default Performance Test CPU 100 X 16 => 1600.2MHz DDR3 1333 CL6 6-6-18 1T GPU 500MHz Hyper PI 32M X2 => 40m 52.730s CPUMARK 99 => 127 Nuclearus Multi Core => 3122 Fritz Chess Benchmark => 3.27/1567 CrystalMark 2004R3 => 77537 CINEBENCH R11.5 CPU => 0.63 pts CPU(Single Core) => 0.32 pts PCMark Vantage => 3646 AMD E-350 spec is X2 1.6GHz and 1MB L2 cache. It’s no L3 Cache. CPU performance is similar to Intel Atom. Even though AMD launch later, at least this is a big step to enter HTPC and NetBook market Temperature (Room is 20℃) System Standby - 51~52 CPU Full Speed - 65~66 Intel Burn Test v2.4，Stress Level Maximum 40nm is more advance than normal AMD 45nm CPU, however, the temperature is still not big different. E-350 full speed and standby temperature are almost same. This could be kind of strength. Power Consumption Test System Standby - 25W

These years, the Home PC becomes smaller and smaller. Formerly, Micro ATX was the mainstream of small form factor P. Now, you can see more and more ITX MB in the market and most users use it to build HTPC. HTPC full name is Home Theater Personal Computer and the advantage is smaller volume. Also users can have enough performance in multimedia applications. This is the main reason to make HTPC more popular. Two CPU companies are competing badly in Desktop PC. Intel owns Atom structure years and most been used in NetBook and AIO PC. It’s hard to find in retail channel. After then, some MB brands announced H55 or H61/H67 ITX products. They combine Intel CPU having very good performance. H55/H61/H67 are Intel mid-high end HTPC platform. AMD platform is hard to see in mainstream ITX segment. There are still some MB makers produce AMD ITX products, but the price is much higher. Recently, AMD launched latest Fusion structure to enhance own capability. It can use for HTPC and NoteBook. This time I would like to introduce AMD latest Fusion, GIGABYTE E350N-USB3. The packing size is similar to previous GIGABYTE H55N-USB3 ITX. They both use small package. Accessory Manual, Quick installation Guide, IO shield, driver CD and SATA cables. GA-E350N-USB3 Mini-ITX size is 17 x 17 cm Chipset is AMD Hudson-M1 FCH/AMD dual core E-350 processor/AMD Radeon HD 6310 Graphics Chip Backside The cooler is fixed by 4 screws. 1 X PCI-E X16 supports X4, It provides users to use chassis which supports the Low Profile VGA spec. 4 X Blue SATA, provided by Hudson-M1 FCH and supports SATA3 Realtek ALC892 supports 7.1 channel and High Definition Audio technology 2 X DIMM DDR3 support 1066/1333(OC) and DDR3 max capacity is 8GB Next is 24-PIN power connector Central is the black active cooler Below is the AMD APU, CPU integrates with GPU Chipset includes Hudson-M1 FCH and CPU AMD dual core E-350 processor IO D-SUB/DVI/HDMI 1 X PS2 KB/MS 4 X USB 2.0(Black) 2 X USB 3.0(Blue) 1 X RJ-45LAN 1 X S/PDIF Output USB 3.0 chip is NEC D720200AF1

StreetFighter IV Benchmark 1280 X 720 => 47.49 FPS DEVIL MAY CRY4 1280 X 720 => 48.49/43.25/57.83/33.63 fps FINAL FANTASY XIV 1280 X 720 => 881 Using the H67H2-M BIOS overclocking GPU functions to achieve more than 34 times overclocking speed shows that the HD3000's overclocking capabilities are not to be underestimated. Generally speaking, overclocking to 1700 ~ 1800MHz is not too difficult. After overclocking, 3DMark Vantage has a nearly 50% performance improvement. In other areas, StreetFighter IV has gains of about 20%, and DEVIL MAY CRY4/FINAL FANTASY XIV, about 30%. For benchmark games such as 3DMark Vantage to have such great 3D performance, consumers should be more satisfied. The improvement in audio and video performance is a major feature of Sandy Bridge. Next, we tested Intel's new Quick Sync Video Technology, MediaEspresso to compare the built-in GPU and external VGA and the time required for video conversion of a DVD file called VTS_01_1.VOB with a size of 1023MB, 2500K into an MP4 file. Intel HD Graphics HD3000 Turn on Intel Quick Sync Video (better quality) 6 minutes 49 seconds msi N560GTX-Ti Twin Frozr II Using nVIDIA CUDA technology 8 minutes 09 seconds For this file, Intel's Quick Sync Video was 1 minute 20 seconds faster than the nVIDIA CUDA. If you use an external VGA with CUDA and switch to Intel's built-in HD3000 H67, you get a time improvement of about 37% or more. If you are using external VGA, you cannot take advantage of the Intel Quick Sync Video technology. This is something you need to be aware of. In addition, with the two file conversion technologies, video performance is also something we care about. In the future, I will carefully note the differences. Video playback test With movies on hand that I've bought, I used Blu-ray versions of “Inception”. The copyright for the above video belongs entirely to the owner. With a Blu-ray movie, you have to use PowerDVD mode, and on a Windows desktop, it's not easy to do a video capture, so a direct capture screen is used as a reference here. The CPU utilization rate is approximately 13 ~ 20%, and with the HD resolution of 1920 X 1080, video playback is smooth. ECS H67H2-M Advantages 1. H67 is a more high-end product with attractive packaging materials and good accessories 2.15μ gold contacts, Realtek RTL8111E chip, USB 3.0/eSATA and other materials 3. BIOS overclocking with the GPU provides features that set Sandy Bridge's 3D performance at a higher standard 4. 2500K with satisfactory power consumption performance and overall performance also at a high level 5. Qooltech III for dual heat-pipe thermal module, built-in debug LED and POWER / Reset button Disadvantages 1. The recommended BIOS option is to turn on the DDR3 clock, allowing the user the freedom to choose 1066/1333 2. The surface area of the heat sink near the CPU is too large, and if you want to install a better cooling device, there may not be enough room. 3. Compared with other first-rate MB factories, in the future, expansion of retail channels and repair services by ECS will provide greater convenience to consumers, both areas they care about. Performance comparison ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ Materials comparison ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ Specifications comparison ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ Appearance comparison ★ ★ ★ ★ ★ ★ ★ ★ ★ ☆ Price to performance comparison ★ ★ ★ ★ ★ ★ ★ ★ ☆ ☆ The performance of the H67H2-M launched by ECS is very good in all respects. With the BIOS, if more DDR3 options can be added, that will be an improvement. Specifications and materials of the H67 compared with those of other MB manufacturers are fairly standard. The scalability enabled by the dual network features of Micro ATX, USB 3.0 and eSATA creates a high-end PC host. The price of US$149 is equivalent to NT$4,372. For these material standards, the high-end H67 is a bit pricey. Compared with other MB brands, the H67 is a bit expensive, yet the price to performance of the ECS H67H2-M is fairly good. The integrated Sandy Bridge chipset's great value in the future should be targeted at the H61, allowing more room for pricing. Regarding the Intel 6 series chipset bug incident, ECS on February 7 issued a statement on its website. The company halted shipments of the Sandy Bridge B2 version, and the company will unconditionally replace all sold goods with the B3. This policy and those of other top-line MB manufacturers is very sincere in the hope of keeping the design flaws of the P67/H67 to a minimum. The entrance of the Sandy Bridge architecture to the market has enabled the performance of Micro ATX MBs and multimedia to make very clear steps forward. The conversion efficiency of Intel's Quick Sync Video is especially impressive. For those consumers who prefer a small PC host this is a great benefit, but prior to the H61's market debut, the H67 is a higher priced option. This report shares specifications and descriptions of all aspects of the ECS H67H2-M's performance as reference for consumers. This review also post in my blog WIND3C Welcome 3C lovers to visit and advise. Thanks

Temperature performance (room temperature about 20 degrees) System Standby - 20 ~ 29 CPU full speed - 66~71 Intel Burn Test v2.4，Stress Level Maximum For use of Intel's original copper base heat sink, I personally recommend that prior to installation users should add a coat of thermal grease to improve heat dissipation. The 2500K temperature shown by the motherboard's hardware monitoring by means of software as demonstrated by the data above was slightly in error and was not the actual temperature. It seems the temperature data is a bit high, and the actual air temperature near the heat dissipator didn't feel so hot. Perhaps the high temperature measurement was the result of the measurement software. Power Consumption Test System Standby - 29W CPU full speed - 111W With the C1E 32nm process, the energy-saving technology of the 4Cores 2500K takes power consumption to a staggeringly low level. At full speed, power consumption is also acceptable, and even if in the future VGA is used in the mid-range product line, the PSU may need 400 ~ 450W only. The H67H2-M platform with the H67 chipset lets consumers have a higher performance host PC or HTPC. The Sandy Bridge architecture is different from the previous generation LGA 1156 platform derived from the Core i3 ~ i7 CPUs with a full range of internal GPUs. Under the Intel HD Graphics line, there are the HD2000 and HD3000 series. For the high-end HD3000, currently only the 2405S/2500K/2600K of the HD3000 series are equipped with GPUs. The following test is for the i5-2500K together with the HD3000, ordinarily operating at 850MHz with the highest default clock of 1100MHz. In the first half of the BIOS portion, the 22-fold frequency is mentioned. Intel HD Graphics HD3000 Benchmark Default clock 1100MHz 3DMark Vantage => P1677 StreetFighter IV Benchmark 1280 X 720 => 40.42 FPS DEVIL MAY CRY4 1280 X 720 => 37.14/32.26/41.35/24.38 fps FINAL FANTASY XIV 1280 X 720 => 669 3D performance of the H67 platform is a huge improvement. Compared with the previous generation i3-540 H55, the 3D performance of 3DMark Vantage is four times better. With StreetFighter IV Benchmark, it's about twice as good. This built-in GPU is a great leap forward after the previous LGA 1156's built-in 3D performance caught up with rival AMD. This time, the multiple gains in the 3D performance of Intel's LGA 1155 Sandy Bridge platform times provide Intel a clear advantage to aggressively expand its share in the HTPC market. 1700MHz overclocking 3DMark Vantage => P2536

Test platform CPU: Intel Core i5-2500K MB: ECS H67H2-M DRAM: CORSAIR CMX8GX3M2A1600C9 VGA: Integrated Graphics HD: Intel X25-V 40GB RAID 0 POWER: CORSAIR CX430W Cooler: Intel original manufacturer cooler OS: Windows7 Ultimate 64bit CPU use of Core i5-2500K The product name is the Intel Core i5-2500K. The K series appeared in 2010, signifying that the clock function is unlocked at 3.3GHz, enabling a new generation of Turbo Boost 2.0 technology, with performance up to 3.70GHz. Entity 4 Cores but without Hyper-Threading technology and a total of up to 4 threads, referred to as 4C/4T 32nm process technology, power 95W, total of 6MB L3 Cache. The LGA 1155 is currently in the second rank of the high-end CPUs. Because the Sandy Bridge i3 series will be on the market after the end of February, at this point for testing we'll use the high-end 4Cores i5. Later, if I get my hands on an i3-2100, I will do detailed performance tests to understand the actual performance of the built-in GPU on the i5-2500K. Performance CPU 99.8 X 35 => 3293.4MHz Power on Turbo Boost, power on C1E DDR3 1064.4 CL7 7-7-20 1T Hyper PI 32M X4 => 11m 54.091s CPUMARK 99 => 568 Nuclearus Multi Core => 19330 Fritz Chess Benchmark => 20.81/9986 CrystalMark 2004R3 => 223913 CINEBENCH R11.5 CPU => 5.41 pts CPU(Single Core) => 1.47 pts PCMark Vantage => 15688 Windows experience index - CPU 7.5 The i5-2500K CPU together with the H67 had advantages and disadvantages compared with the P67 that was previously tested, but the differences were not many. The H67 and P67 chipsets were very similar in performance under default settings, and the performance was not bad. Compared with the previously reviewed i5-760, the new 2500K CPU had performance improvements of about 2 to 3 percent On one hand, with the same clock speed, the LGA 1155 had about 10% higher performance than the LGA 1156 With the i5-2500K at 3.3GHz added to the mix, the i5-760 running at 2.8GHz was the only factor behind differences in performance. This is provided to all netizens as a reference. DDR3 bandwidth comparison DDR3 1064.4 CL7 7-7-20 1T ADIA64 Memory Read - 14091 MB/s Sandra Memory Bandwidth - 14133 MB/s From the above bandwidth performance test of DDR3, we can see improvements on the problems of the older generation It is simply the built-in GPU of the CPU that lowers the bandwidth of the DDR3. This is a special characteristic of the LGA 1156 i3/i5 32nm CPU. The Sandy Bridge i5-2500K has the same built-in GPU but the DDR3 bandwidth allows excellent performance. Only working with DDR3 1064, it already operates at a bandwidth about 36 to 59% higher than the previous generation i3-540 DDR3 1333. We hope that in the future we will have the opportunity to share our experience with the i3-2100 operating with such a high bandwidth. The lack of BIOS options for DDR3 1333 is something of a drawback.

IO D-SUB/DVI/HDMI / Display Port clr CMOS button 4 X USB 2.0 (Red / Black) 2 X USB 3.0 (Blue) 1 X eSATA / USB 2.0 Sharing (red) 2 X RJ-45 Internet port 1 X S / PDIF Equipped with ECS Black Series typical Qooltech III dual heat-pipe thermal module design LGA 1155-pin layout With 15μ gold contact, commonly known as triple gold material BIOS screen M.I.B X, ECS overclocking technology This page has to adjust the voltage options. DDR3 1T/2T with the current CPU clock / DDR3 capacity / voltage status CPU Voltage +20 ~ 320mV DIMM -800 ~ +630 mV IMC Voltage +15 ~ +675 mV ICC overclocking options page CPU technology configuration page TurboBoost, C1E option can be selected for reduced power consumption DRAM timing information Intel integrated GPU overclocking options When overclocking, it is recommended to first set Graphics Current to Max When the clock is set to the Graphics Core Ratio Limit, default is 22 Each level of the clock is 50MHz, and in the figure 34 means 34 X 50 => 1700MHz IGD Memory has three options, namely 32/64/128MB For DVMT / FIXED Memory, there are three options, 128/256MB/Maximum Other CPU related technology options In addition to turning off C1E, Power Technology should also be shut down so that the CPU can be maintained at the default 3.3GHz operation. PC Health Status The H67 chipset does not provide a CPU multiplier or FSB overclocking options. Essentially for All In One PC use, so in this regard Intel has created more restrictions compared with the previous LGA 1156 generation. But the built-in GPU overclocking option is the special characteristic of the H67. The BIOS design of the ECS H67H2-M takes this into full account.

The latest generation in the Intel architecture is the LGA 1155, officially released in early January of this year. In the first wave of the 6 series chipsets were two chipsets, the P67 and the H67. The two have different market positions and based on the previous LGA 1156 nomenclature rules, the P stands for high-performance without VGA output. As is common with the ATX design of the H67, it is clear that it has a VGA output but no CPU overclocking capabilities and is therefore suitable for combination with the Micro ATX specification. From January to now -- the end of February -- windwithme has shared reviews of two types of P67 overclocking test-use CPUs, the more popular i7-2600K and the i5-2500K, as next-generation PC platforms for performance and overclocking. However, on January 31, Intel announced that there were bug issues in SATA2 devices under which prolonged use might result in degradation of HDD performance. At the same time, Intel announced the recall of the B2 chipset and as quickly as possible provided the new B3 version chipset in March to resolve this problem. This forced all MB/NB manufacturers to respond as quickly as possible, and nearly all the MB makers had to recall products or offer replacements to those who had already purchased the motherboards. In response to this news, I hope all consumers can understand more about the current status of the 6 series chipset Back on the main topic, at this time, I am sharing the first article on tests of the Intel H67 chipset with an Elitegroup-brand motherboard, the model H67H2-M. This is part of the Black Series, a high-end product line started more than a year ago. Elitegroup has been selling it on the web, in shopping malls and even on the OC market, hoping to gradually enter the consumer market and build their brand image. The H67H2-M packaging has bright reflective material, making this product eye-catching Accessories Included English user manual, a quick guide, IO panel, driver software on a CD and plastic protective covers for the IO interface SATA cables and eSATA connectors H67H2-M enclosure The mainly black PCB has a sticker listing the main features of the product the CPU and the DDR3 slots with 15μ gold contact that triple the antioxidant, heat resistant and scratch resistant properties of ordinary products. Micro ATX specifications, dimensions 244mm x 244mm H67H2-M products are the top of the H67 line in terms of materials, and in design are different from other entry-level H67 products Motherboard lower left 1 X PCI-E Gen 2.0 X16 2 X PCI-E X1 1 X PCI Realtek RTL8111E dual network chip with support for teaming Realtek ALC892 audio chip supporting 8-channel High Definition audio Etron USB 3.0 controller chip, at back two USB 3.0 IO expansion units Lower right of motherboard 3 X white SATA, H67 installed, SATA2 specifications 2 X grey SATA, H67 installed, SATA3 specifications can be used interchangeably and can support RAID 0, RAID 1, RAID 5, RAID 10 and other specifications Power, Reset button, built-in Debug LED The heat sink designed in a flame shape. Below is the Intel H67 chipset single-chip design Top right of motherboard 4 X DIMM DDR3, supports 1066/1333, maximum DDR3 capacity of 32GB. Adjacent to the 24-PIN power input Motherboard upper left Place for installation of LGA 1155 CPU The H67H2-M uses 4 +1 +1 power input. Intel limits the H67 CPU to operate without overclocking as the 32nm process technology is up to the task.

Youtube Inception 1080P - CPU => 15~19% Final Fantasy 13 1080P - CPU => 13~20% The copyright reserved of each vedio belongs to its original company. Battery Duration 4Cell battery, Battery Eater Pro (turn on wifi and bluetooth) Full Speed - 1:11:02 Idle - 4:40:28 HP ProBook 5320m Performance ★★★★★★★★☆☆ Components ★★★★★★★★★☆ Specification ★★★★★★★★☆☆ Outlook ★★★★★★★★★☆ C/P Value ★★★★★★★★☆☆ This review also post in my blog WIND3C Welcome 3C lovers to visit and advise. Thanks