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mickulty last won the day on May 17

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  1. I started out doing mhz testing with 4 DIMMs with a Ryzen 1700+AB350-Gaming. This was supposed to be a joke, troll some of the r/oc discord guys like "yeah I'm testing that IC, but in a crappy configuration lol". I was expecting maybe 3200 since it's a T-topology board. Anyway they do DDR4-3600 daily stable. Which for 4 DIMMs on first-gen Ryzen is just insane. So this is actually really interesting data, makes me think these sticks might be super easy to run somehow. Screenshot attached, timings are very much quick and dirty and not tuned at all, I just set primaries and mhz. EDIT: Interestingly, the same settings were pretty unstable in 2-dimm - T-topology in action, but interesting that it's a factor at these lower speeds.
  2. Those are 512Mx16 layout (4 chips per rank), AFAIK they're not used in high-performance modules because of less bank groups hurting performance or something. I've made a thread in memory heaven as I think there's a lot of information to go through.
  3. Thought it was time to start collecting information in one place about this new miracle IC that the OGS guys used to smash the memory frequency WR. There are a bunch of different IC codes for "8Gbit Revision E" and while the characteristics should be broadly similar there's definitely some variance - not sure how much of that is down to binning for kits and how much is down to differences between different Micron models (JEDEC bin, temperature bin, maybe package?). These are found from micron's ic code lookup tool, and model numbers are interpreted with the help of micron's 8Gbit DDR4 datasheet. The known standard (1Gx8 layout) Rev.E IC codes, excluding Z9 series ES chips, are: D9VPP - '075' JEDEC bin code, no extended temperature code D9WFL - 062E' JEDEC bin code, no extended temperature code D9WFP - '062E' JEDEC bin code, 'IT' extended temperature code D9XSP - '062E' JEDEC bin code, 'AAT' extended temperature code D9XSJ - '062E' JEDEC bin code, 'AIT' extended temperature code D9XSK - '062E' JEDEC bin code, 'AUT' extended temperature code C9BHS - '075E' JEDEC bin code, no extended temperature code (=D9VPP?) C9BJC - '062E' JEDEC bin code, no extended temperature code (=D9WFL?) C9BJZ - '62M' JEDEC bin code, no extended temperature code (these ones are on the WR sticks) It should be stressed that these aren't all necessarily available, they just show up searching for part numbers. There's also C9BHR - '083E' JEDEC bin code, no extended temperature code. Micron's site lists these as Rev.H, but it's possible this is an error - usually IC codes with the first 4 characters the same would be variations of the same IC (eg D9GTS/D9GTR/D9GTN). 062E is 3200C22 jedec bin, 075E is 2666C18 jedec bin, 075 is 2666C19, and 083E is 2400C16. The 62M jedec bin code doesn't seem to be documented. Temperature wise IT/AIT, AAT, and AUT are rated from -40C to 95C, 105C and 125C respectively. ICs without temperature codes are rated for 0C-95C, this doesn't necessarily really mean anything though. Micron 8Gbit Rev.E has been reported, to my knowledge, in: 8GB Ballistix Sport LT 3000 15-16-16 (multiple users in the r/overclocking community have these) 16GB Ballistix Sport AT 3200 16-18-18 dual rank (recently reviewed by techpowerup) 8GB Ballistix Elite 3600 16-18-18 (WR sticks) Overclocking characteristics are: Apparently no CB/CBB Scales with voltage Very temperature sensitive At least the low bins seem to need high tRCD A couple of different r/overclocking users have reported 3600 14-20-16 1.45V on AMD using the 3000 15-16-16 sticks. This is really interesting because it suggests a reasonable amount of variation if the lower-end sticks need tRCD 20 for 3600 whereas higher-end sticks can do 3600+ at tRCD 18. My personal theory (and I realise it's a bold one): the 62M JEDEC bin code on C9BJZ might be like elpida's MNH and MGH codes seen on 1Gbit Rev.A DDR3 indicating the unofficial 'HYPER' bin - that is, the result of some kind of sorting done at Micron/Crucial for OC above and beyond any official JEDEC bin, separating ICs of the same design that exhibit similar characteristics but with a big difference in the typical numbers. I'm currently busy testing some 3000C15 Sport sticks that I picked up today, but I'll try and keep this post up to date as more information comes to light 🙂
  4. Thanks, I'd forgotten that there are special bins and part #s for crucial. Not sure those even have a direct equivalent in the D9xxx series, D9WFL's equivalent is C9BJC.
  5. Do you know which specific IC code is on these chips? Looks from the micron FBGA and Component Marking Decoder like 8Gbit Micron Revision E DDR4 has a couple of different ones, not counting other widths than x8; D9VPP, a 2666c19 JEDEC bin D9WFL, a 3200C22 JEDEC bin D9WFP, a 3200C22 JEDEC bin also certified for 'industrial' use down to -40C D9XS*, a 3200C22 JEDEC bin with various automotive temperature bins (-40C to 105C) I'm guessing D9WFL? It'd be good to have something to call them other than "E-die", I've already seen some folks get confused and think it's the return of 4Gbit Samsung.
  6. Yeah I was pretty annoyed a while back when I wanted to try out whatever micron's best 4Gbit IC was in a 2x4 kit and ended up with samsung e-die, lol. There are other examples but I fear we'd stray from the topic 😃
  7. Ballistix Elite use - or rather used to use, it seems - samsung b-die at least for high bins.
  8. Wow, good spot - the spd tab reports it as micron! EDIT: As does the comment on the score, I'm blind lol
  9. I think you might need to remind yourself of the original post; Given that the XP/7 requirement doesn't exist for modern Intel, and is not onerous on older hardware, what on earth is it about if not Ryzen?
  10. I feel like the OP's original point has been lost in a stupid slapfight. Regardless of what's optimal, if you're trying to get someone new into competitive OC they're going to be put off if they can't do it with their daily system or an OS they're familiar with, and *extremely* put off if they have to try and install something that's not supported on their platform. They don't need to be told "well you should install XP anyway to be competitive", they need a way to get involved on 10. Doesn't have to be efficient or competitive. 3D is alright for this because Futuremark/UL stuff is fine, but simply not being able to post cinebench/superpi/wprime/etc scores on ryzen without hacking an unsupported (on that platform) OS together really sucks. Philosophically, it's an easy problem to solve without upsetting anyone - offer wrapped versions that people are free to run on whatever OS/hardware as the default download. Continue to offer unwrapped versions if the unwrapped bench is felt to be secure enough, for people who are willing to faff around with older OS's. The "only" difficulty is the production of the actual wrappers.
  11. They're all the same clocks, except for the 210 which I think is actually a bit slower. Shouldn't be any benefit to the other models other than maybe a little easier to get hold of for some people in some situations, especially if someone wants a job lot to bin.
  12. 5450 would be good, they really are cheap as chips and seem to be widely available (think they were in production to relatively recently, might even still be made?). Could it perhaps also include the other Cedar rebrands? So 6350, 7350, 8350, and R5 210. That way there's more flexibility to maximise availability.
  13. Makes sense for new benchmarks, but I don't envy whoever has to enact the purge if that's extended to the stuff with things like LOD and tess "grandfathered" in as tweaks.
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