Rauf
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Posts posted by Rauf
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Saw same thing with GTX 480. Really bad Nature in 01 and 03. 980 Ti is fine though.
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I think I used 1.94 for 6.2
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Still available.
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Congratz...many good Galaxy cards in Brazil I see!
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I'll take the Fluke 52, for that premium feeling when benching
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Yes, but the question is if people really care about long term rankings or if competitions with a fixed start and end date is better? I don't think the individual ranking is that important to most people here, would the team ranking be more important? Once a team has filled their quota of benchmarks what is there left to do?
With competitions there is a time window in which you can rally team members and organize hardware. When that competition ends, soon there will be another which would feature other hardware/benchmarks and people can rally towards that.
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Maybe a returning team competition tied to Pro/Challenger seasons would be one way to keep more people interested. Country cup is very popular, but it is only once a year. Team cup is old school, and then there is actual old school. But what is there for more newish hardware? If you are not a hardcore old school bencher you are most like sitting on hw that is around 1-3 (maybe up to 5) generations old. A competition for this type of hw on a smaller scale than country cup, tied to the same time table as challenger, would be very nice. 5 stages, and 3-5 results per team.
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Up for sale is a good i3 6320. Did 6.2GHz Hwbot Prime on LN2 around -180.
It's also a 5 GHz air chip.
Price is 210€ plus shipping. Buyer covers paypal or bank fees.
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Second card (GOC) back up for sale! 600€ shipped in EU.
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Well done! And nice cpu.
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Lol@XA!
I'm not much for ranking "the best ever" in anything. It usually ends up with the current nr1 as the best ever...
However I do agree that the level of dedication and results from Dancop is amazing. I think few people understands the time and money that needs investing for something like this. Nothing is for free, even when you have good hardware support. Especially evolving new techniques and OS/software combinations, which then everyone can copy. For me it is very hard to motivate trying new things on LN2. I have foremost limited time when on LN2 and the choice between testing out a new thing that might work to take it to the next level, or going "safe" with the old method usually results in the first option. You don't want to risk a bad session which means time, LN2 and money is lost. The perfect example is the tim cracking on skylake. I ran so many sessions at -180 because I knew how to do this, but I rarely tried anything new to try and run full pot because if you got the crack the session was usually over.
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I don't think it is a bad thing if people have fun and bench together. I would gladly bench with someone if there wasn't >100 km to the closest Swedish XOC. But the problem is that OC is moving more towards competitions and I think we need the same rules for rankings and competitions. For some the ranking is the ultimate competition. It becomes a big problem if you don't have to own your hw with which you enter in competitions...
As for the unfair advantage of a joint account, I don't think it is a problem. XOC is unfair. And anyway, even if we combined all other peoples top scores, I don't think they would beat Dancop in the rankings anyway... Joint account won't take you so far that it becomes unfair.
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I was thinking of trying to design something. A little square that would go around the die a couple mm in each direction. The same height as die. And then we fill up the square with paste so when we put the lid back it will keep the tim in place in a nice square with nice contact.
No need for the square, just put a really big blob of paste on the die and press down the ihs carefully. Make sure it is level while pressing down.
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I think this should be clarified in the rules. Rules say: "CPU may not be shared for CPU benchmarks." Both results in question are cpu benchmarks and the cpu is shared... So you need to change this section in the rules if it is allowed.
Will also help a lot in next country cup. The extreme guys can just hand out results to other people...
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Completely separate global- and hw-rankings for extreme cooling and ambient. No need to complicate things further...
Imagine answering this question from someone new to hwbot: "How do the rankings work?"
Can you explain that and not loose the other person while explaining it?
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Cool. Insane 4-way speed!
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Thanks, it's a Matrix - samsung mems
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Damn, hate when that happens. Good score anyway!
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Good run, but it should be 280ms, not 28...
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Very nice eff!
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Oh, already. Thanks for the heads up. Thought it was two weeks inbetween like before.
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check temps in xtu (when cold)
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Sounds like bad contact. Can happen if you keep the glue on both pcb and ihs and use "normal" amount of tim on the die. I always scrape off the glue on ihs, keep it on the pcb. Perfect mount every time.
Skylake 6700K/6600K Batch and Serial Numbers
in Skylake/Kaby Lake/Coffee Lake (-X) (Z170/Z270/Z370/X299) OC
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Nice chip! How do you manage 27 ambient at this time of the year?