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Dancop

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Everything posted by Dancop

  1. Yes I did...Except for PK1, Hydronaut and NH-1 They were too bad! max Clocks in R15 Kryonaut 6320 Diamant 6150 PK3 6100 DX1 6080 EK Ecotherm 6100 Gelid 6280
  2. That's what I meant with....as tight as it goes With 5 rounds of the screw...136 with 10 165 with 17 ( more is not possible) 185
  3. Hey GUYS! I did a lot of testings the last weeks... Spent more than 150L of LN2, hopefully to help you guys, not doing the wrong TIM on your Skylake DIE My testsystem is: Asus M8G Kingston HyperX Predator 8GB 3300C16 @ 3000C11 Seasonic 1200W Platinum Intel skylake 6600K ES Der8auer BEAST as container for the CPU What have I done? I put all the following TIMs on the DIE of the CPU. On the Intel HS I always used Thermal Grizzly Kryonaut! TIMs I've used: Innovation Coling Diamand 7 Carat Prolimatech PK1 Prolimatech PK3 Thermal Grizzly Hydronaut Junpus DX-1 EK Ecotherm Gelid GC-Extreme Noctua NH-1 Thermal Grizzly Kryonaut Then I went into Windows 7 64bit with the following settings: 5200/5200 on the core/cahce Voltages: Vcore: 1,75V (just to be sure, to generate enough heat) VDIMM: 1.6V Core PLL: 1.8V DMI: 1.37V VCCIO: 1.3V PLL Termination: 1.6V Standby Voltage: 1.5V Bandwith: 6 Temperature measured with the ASUS Batmobile (OC-Panel 2) For each TIM I've tested it twice with de-mounting and renewing all the TIM! Then I did two several tests. Finding the "Crack-Point" in idle and on load (Cinebench R15)! The "Crack-Point", I call it Ice-Ball point, cause it sounds (it is truly hearable!!!) like the little Ice-Ball which you have to crack in Taiwanese menthol cigarettes, when the TIM reaches its lowest temperature, before it looses contact to the POT, IHS or DIE. For me it looks like it's a matter of bonding agent (I don't know the right expression in english! I mean the fluid, that makes the TIM more or less fluent). When this "bonding agent" gets too cold, then it starts to get hard and cracks because of the different coefficients of expansion between silicium and copper. You can reproduce cracks when you are on heavy load and the pot is very cold and your cpu crashes. Then the silicium turns from approximately minus 20 degrees to minus 160 within a milisecond! The copper from the pot and the IHS already has its typical size for this kind of temperature, but the silicium changes it right now, which makes it much smaller compared to the size it has while load! The most important thing is the follwing; mount your pot as tight as it goes! At least, that's what I found out! Now you wanna know which TIM is the best (I can only name the pastes I've tested, so if one is missing, let me know, or if you're a TIM vendor....send me!) Here ya go: Please guys, share your experiences...I hope we can find THE right TIM soon!!!! Right now it is Thermal Grizzly Kryonaut!
  4. It is this one...6g r15 1.65v...I did a mistimed with this run sadly
  5. Should we create a separate thread, cause I think this worth for each kind of cpu
  6. Who cares??? Gpupi gave points within one month...same for geekbench and so on...let the wrapper work as a beta for 3 month...many will use that one in other forums as well! Then launch it and we all have fun with doing a real mem benchmark! Do we have any real mem benchmark? No....not in my opinion...
  7. Also with 4500 cache? If yes...nice chip. Might be one of the best
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