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der8auer

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Everything posted by der8auer

  1. Yep volume is about the same. Did not measure the volume of the ney pot but from the looks it should be alright.
  2. The screenshot is taken after 1s of simulation as it's a static simulation and no dynamic simulation. The boundary conditions are basically the heat-radiation to the ambient air, LN2 inside and the 500W load. As you said it's way too difficult to do a 100% correct simulation. The biggest problem is that LN2 is not cooling down steady. The temperature coefficient between the LN2 and the copper is the biggest problem here. Decreasing the temperature of the pot the temperature coefficient is increasing. So it's impossible to do a simulation e.g. of how long it takes to cool down the pot or to measure the temperature you can reach. But you can clearly see the heat transfer inside the design which is enough to see whether a hole is placed at a wrong spot or which mass actually helps as a buffer. Yea I can decrease the thermal radiation from the ambient air which will make the pot appear in a deeper blue. Ofc it's more realistic with insulation but this way you can see the thermal transfer a lot better between load and LN2. It depends on the insulation material you're using. Using the real armaflex it helps up to about 14mm thickness. You will just need less LN2 but the performance of the pot won't change.
  3. Hahaha epic meme I tried at least. The biggest problem is always if you want to support all kind of modules. Single-sided, dual-sided and modules with IHS and keep a good heat-transfer at the same time.
  4. The question is: Does anyone have any of that stuff? I can't even participate in a single stage haha.
  5. I'll release my new memory pot in about 1-2 weeks. I won't hide that I tested three other pots and thought about improving and combining designs instead of reinventing the wheel. One part of the development was a thermal simulation e.g. to check the perfect thickness of the heatspreaders, position of screws and stuff like that. I can't show the memory pot pics yet but I also did a simulation of my SLIM pot and thought the pics could be interesting I've heard a lot of trollscience about pots and stuff about how "heat spreads" but I'm pretty sure none of those guys ever did a real test. The pictures show the pot in an non insulated condition. Means not covered by armaflex or anything else. Just ambient temperature at +20°C. For the simulation the holes were filled with LN2 (not the complete pot!) and a 500W heat source with about 4cm² size was placed in the middle of the contact area. Will post more soon including stuff about the memory pot
  6. Dude you're getting old Happy birthday!
  7. Agreed. It's all about a lucky high score.
  8. Yes according to the rules you have to list a price if you want to sell your CPU. Don't forget the picture.
  9. crazzzy85 will probably sell his GPU pot from country cup. Try to PM him.
  10. Albrecht you have to would be sad if you dont make it.
  11. Loopy from BenchBros posted on HardwareLuxx that MSI simply did not recieve enough GPUs from Nvidia to build the lightning cards...
  12. Guys the command and the COMPLETE cmd window have to be visible! Check example screenshot here: http://blog.hwbot.org/wp-content//ucbp1.jpg
  13. The guys who manage the location delay everything... Nothing set in stone yet.
  14. REGISTRATION Registration is now open. This is the English site: https://computex.leadexpo.com/EN-index.html Overclockers Attending Considering: - Splave - FireKillerGR - XtremeAddict - Christian Ney - marmott - Bullshooter - crazzzy85 - l0ud_sil3nc3 - pro - riska - Leeghoofd - redmax - Black Cobra - ViVi - steponz - borandi Going: - der8auer - sofos1990 (1.6. - 12.6.) - pastelidis (1.6. - 12.6.) - Lucky_n00b - dinos22 - Massman - Hiwa - M.Beier (30.5 - 21.6.) - marmott OC EVENTS [gcal=20140601%2F20140630]hwbot.org_42u2gk3mu5vf4ode8gehb5qsco[/gcal]
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