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rtsurfer

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Everything posted by rtsurfer

  1. That would actually be bad, because while tightening the hold down, it will slide the IHS forward. A better option that I did a couple of days ago was to put the CPU on top of a few layers of paper towels on a flat table & then put my F1 Dark on top of it. The paper towels are there because of the capacitors on the bottom of CPU, which prevent us from putting it, by itself, on a flat surface.
  2. Haven't had any issues with mine, except they could have included a better applicator. But this can be improvised. And the other one comes with the same applicator too. Not going to try the other one, unless something happens to this whole tube that I got or someone comes up with a drastic difference. Tbh its just a sealant, I don't expect an earth shattering differences between the choices. Sent from my SAMSUNG-SGH-I337 using Tapatalk
  3. I went with the other one, because 1) It was cheaper 2) Didnt know if this Ultra stuff would be too hard to remove or not. Good to know that it works just the same. Thanks.
  4. Thank for the share. I used this to reseal my CPU http://www.walmart.com/ip/Permatex-Black-Silicone-Adhesive-Sealant/16879902 But, I wasn't satisfied with the TIM job (big temp disparity between cores), so I cut it off & redid the TIM. Was easier than cutting through stock Intel adhesive. Just remember to give the sealant enough time to dry (24 hrs), for the first few hours, its easy to disorient the IHS because the sealant hasn't dried.
  5. Wait, you talking about the big one(full size ES board) or the upcoming small one.?? The only reason I didn't buy the big one till now was because the mATX version was supposed to be better.
  6. The only 'special' board on that list is the Impact. I say block the Impact & move on. All the other boards can equally max out MFR anyways. Also while we are at it, how is Hwbot going to make sure that people are not using the 2 slot OCF.???
  7. Quick question, how much is the difference between BIOS DRAM voltage & DRAM Voltage measured from a proper quality DMM, on this board.
  8. Alex@ro can you check if the 2 Dimm Xtu efficiency is fixed with this board .??
  9. 3200C15 should be interesting. ;-) 3466 should be D-die unless you get lucky. I'd return them. 3733C17 is one the most interesting spec in the Gskill lineup, but it's not confirmed whether it D-die or E-die. 3866 & above are confirmed to be E-die. You can tell us about 3733 bin. SS 8GB sticks have been in the work for a while, but they should obviously OC worse than their 4GB counterparts. DS 16GB AFR should be interesting.
  10. Those are still MFR. Unless you are going to freeze em', I would just go with Samsung E-die. LN2 AFR like performance, on air & retail.
  11. Sure about that..? I was told editing SPD on DDR4 might not be that simple. http://forum.hwbot.org/showpost.php?p=396748&postcount=12 If the companies hand it out with retail SPD, then yes, its all pointless.
  12. rtsurfer

    CryoClamp

    Can be closed now, thank you.
  13. rtsurfer

    CryoClamp

    Looking for an Der8auer CryoClamp RAM pot with all accessories shipped to USA. Let me know if you have one you are willing to part with.
  14. I can push upto 1.9 Vdimm on air, but only get till 3100C11. I have very bad RAM.
  15. Had 2 CPUs, but sold the other one. On air it appears that I can push more voltage on Z170.
  16. Seen that happen on Asus boards, does it happen on Asrock too.?
  17. A question not specifically related to this board but to the Z170 chip set, did anyone one you guys notice that the RAM is asking for more Vdimm for a set profile vs X99. For Example, 3000C11 needing 1.65V on X99 & 1.7V on Z170. Is this only happening to me or universal. ?
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