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Splave

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Everything posted by Splave

  1. I think all the mods should post their cell phone numbers
  2. you can use a heatgun and bend it back no problem if it bends Also vivi has the right idea but I use scraper razor blades they have a blunt side. Seems better if you dont push hard just get the corners loose first then little by little on the sides. my 2 cents I have 25+ under my belt without death.
  3. 4x4 is better on Asus it seems, on ocf uneed to tighten the right mem timings
  4. Thanks guys, very supportive bunch of people here appreciate it greatly
  5. Difficulty is only relative to the user. 32m is easy for me. Single card fse more difficult. More people benching 2d then award more points to 2d because there is more competition. VGA expenditures is causing a rift in 2d vs 3d. Also if you have deep pockets you can still bench air 4 way and get wr points no problem, how is that fair compared to someone working hard to push 2d on ln2. I think it's fine the way it is now.
  6. thanks men, BSOD on save file is soo funny can only laugh
  7. are you tired of the memory page of bios yet? haha
  8. Uh oh youve seen too much
  9. Its common knowledge skylake TIM is less than optimal, So I had some Indium Foil left over from some previous playing around.... INNNNDIUMMM, very heavy for just a small thin sheet. Its about 2-3 sheets of paper thick. Nice size piece over the die, it shrinks a little when it melts. Melting point is 157c so went well above that. "A rapid cool down is desired to form a fine grain structure. Slow cooling will form a large grain structure, which typically exhibits poor fatigue resistance. The acceptable cooling range is -0.5 to -6.0C/second (-2.0 to -6.0C/second is ideal)." Tried to maintain this using ln2 to cool it back down. Finished Product is nice and strong which is a good sign. :yepp: End Result, not great, not bad. 4ghz Core 1.35v through XTU on water cooling. Conclusion Will try a couple other ideas. Maybe the foil is to thin or too thick. Could stack 2 layers. Maybe my application is totally wrong. Either way hopefully indium company engineers respond to my email with some ideas. Keep thinking outside the box, one of these times its bound to be a home run.
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