xxbassplayerxx Posted November 4, 2015 Posted November 4, 2015 You have enough cold juice to try it again? A few others have had success for one session but it usually broke down during the next run. Quote
Strong Island Posted November 4, 2015 Posted November 4, 2015 You have enough cold juice to try it again? A few others have had success for one session but it usually broke down during the next run. ya I guess that will be the test. It's worked twice so far without cracking but with 2 different cpus. Will see what happens the second time I use the same cpu without changing paste If I need to change it everytime I will probably just use the electrical tape so it will be easy to change the paste. Need to refill, ran out last night. Quote
xxbassplayerxx Posted November 4, 2015 Posted November 4, 2015 Report back! I hope we can finally slay this damned chip. SKL FTL Quote
FireKillerGR Posted November 4, 2015 Posted November 4, 2015 3 or 4 sessions in a row; no cracks here Quote
Guest Bullant Posted November 4, 2015 Posted November 4, 2015 3 weeks out of 4 weeks no ln2 so no cracks here lol Quote
nickolp1974 Posted November 4, 2015 Posted November 4, 2015 Anyone tried using a thin line of putty/eraser instead of sealent, would be a more temporary solution and enable quicker TIM exchange if needed. Quote
Strat Posted November 5, 2015 Posted November 5, 2015 3 or 4 sessions in a row; no cracks here Full pot or -170°? Quote
phil Posted November 5, 2015 Author Posted November 5, 2015 Full pot or -170°? -175.It has cold bug at about -180. Quote
Splave Posted November 5, 2015 Posted November 5, 2015 do you put backplate directly against motherboard? Quote
phil Posted November 5, 2015 Author Posted November 5, 2015 No we use a piece of armaflex in between. Quote
Guest Bullant Posted November 11, 2015 Posted November 11, 2015 (edited) So have question I've delided and now use the floating ihs setup the thing is after closing the socket bracket the ihs is now closer to the die because of no silicon that results in squeezing out all the compound that then results in the crack! Lol,so i normaly release the screws on the hold down bracket then close the bracket and then tighten screws back up tight like from factory So would it be better to not tighten screws so tight on the hold down socket bracket or place something between the ihs and the CPU so the ihs don't squash so tight into the die? It seems by over tightening the pot is also bad idea I just seen SI used a tape around the die to raise the ihs up hmm Edited November 11, 2015 by Bullant Quote
Strong Island Posted November 30, 2015 Posted November 30, 2015 so far third straight session without changing tim and not one crack, the thick paste is really helping me, it seems like it defeats the whole purpose of de-lidding but I guess the change to thermal grizzly tim helps a lot. The tape before I resealed seemed to give the same exact effect so might just go with that from now on so I don't have to delid everytime. Quote
xxbassplayerxx Posted November 30, 2015 Posted November 30, 2015 I had two sessions and each one had two different chips. Not a single crack yet. I have not scraped off the silicone residue and I have not re-glued. I'm thinking the gap there is key. Quote
Rauf Posted November 30, 2015 Posted November 30, 2015 Are we talking full pot or -170? Huge difference, -170 is easy. Never any cracks. Have only tried full pot once but got the crack immidiately. No reseal here, just ordinary delid with floating ihs and kryo. Quote
xxbassplayerxx Posted November 30, 2015 Posted November 30, 2015 Are we talking full pot or -170?Huge difference, -170 is easy. Never any cracks. Have only tried full pot once but got the crack immidiately. No reseal here, just ordinary delid with floating ihs and kryo. Full pot on 6700K the second time. First time was around -185°C. If I left it full pot it would CB after about a minute. 6600K actually has a real cold bug, so no colder than -140°C on that one. Quote
FireKillerGR Posted November 30, 2015 Posted November 30, 2015 Both -175 and full pot here. Closing the gap between IHS and pcb is the key. Quote
Strong Island Posted November 30, 2015 Posted November 30, 2015 Are we talking full pot or -170?Huge difference, -170 is easy. Never any cracks. Have only tried full pot once but got the crack immidiately. No reseal here, just ordinary delid with floating ihs and kryo. I go to -180c so not totally full pot. Quote
Achill3uS Posted December 1, 2015 Posted December 1, 2015 i had many times cracks at even -140C with grizzly kryo on delidded cpu without glue ihs back. might give some differences where do you put your probe. Quote
xxbassplayerxx Posted December 1, 2015 Posted December 1, 2015 i had many times cracks at even -140C with grizzly kryo on delidded cpu without glue ihs back. might give some differences where do you put your probe. My probe is in the bottom of my F1EE and even full pot, no cracks. My chip is absolute junk though... 6.2 valid and 5.9 3D03. Quote
Strong Island Posted December 1, 2015 Posted December 1, 2015 i had many times cracks at even -140C with grizzly kryo on delidded cpu without glue ihs back. might give some differences where do you put your probe. ya mine was cracking everytime before I reglued. I even had a time where my pot was around -140c and in xtu the cpu core was hitting close to +100c. Now three times so far about to about -180c without a single crack. But my probe is on pot and not behind cpu. Quote
nickolp1974 Posted December 2, 2015 Posted December 2, 2015 Going to re-seal mine and i'm leaving a little gap in the bottom/middle as original, anyone know why that gap is there in the first place?? Quote
buildzoid Posted December 3, 2015 Posted December 3, 2015 Going to re-seal mine and i'm leaving a little gap in the bottom/middle as original, anyone know why that gap is there in the first place?? The gap is there to prevent air pressure imbalance. 80C air has a lot more volume than ambient air. Quote
xxbassplayerxx Posted December 3, 2015 Posted December 3, 2015 The gap is there to prevent air pressure imbalance. 80C air has a lot more volume than ambient air. It also gives a gap for air to escape while you're pressing the IHS down. Quote
nickolp1974 Posted December 3, 2015 Posted December 3, 2015 So do think it would be beneficial to leave that little gap when re-sealing for LN2 use? Quote
xxbassplayerxx Posted December 3, 2015 Posted December 3, 2015 So do think it would be beneficial to leave that little gap when re-sealing for LN2 use? Yup! Quote
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