Skylake IHS Spacer

[hotrod717]

I have both Gene and OCF. Have more experience with OCF. Like I said, tested with known good chip with no issues. Just doesn't make sense. The 6320 ran fine for one session, but the 6700k has not posted after tool delid. Not a scratch or defect on either. Both chips were briefly tested on water before delid and ran fine. Actually very good.

[Strong Island]

Have an issue, hopefully someone has an idea what the **** is going on, cause I can't figure it out. So I recently delidded 2 chips using delid tool. Scraped glue off pcb and ihs with credit card, as I've done every chip in past. Re-timmed 6320 and ran without any issues. 2nd time I tried running 6320, mobo wouldn't boot. Fast forward to 2 weeks later, today. 2 different mobos. Both 6700k and 6320 will not post. Both look pristine without bend, scratch, or other defect. Multiple mountings and still no post. I've seen codes 14 and 00 on Gene and 04 on OCF. Multiple sticks and configurations of ram, cosm cleared dozen times, no post. Why would this be happening? Never had any issues like this before with delidded cpu. I even checked 1st skylake i bent and it boots no problem. So why would 2 chips using safe method, appear dead?? I'm at a loss.

 

I dont know if this relates to your situation but you mentioned scraping the glue off. I did a perfect delid on my 6700k and it worked great. But I wanted to apply new glue so I scraped off old glue. After scraping off glue cpu wouldnt boot anymore, i tried a few more times to boot and it actually killed my m8e.

 

There wasnt a single scratch or imperfection on the cpu but I must have twisted it a tiny bit when scraping glue, the pcb is so thin.

 

Just be careful not to kill mobo's if the cpu's are dead. That really sucks, sorry you have to go thru it

[dhenzjhen]

I had bad experience also with a chip without glue on. I tested around 30+ SKL chips now mixed of i3/i7/i5s

and delidded around 10. All 10 tested cold with the glue on and no problems, non of them died on me. Then

I bought a delidded chip without glue on so I used white bond paper as a spacer, 1st day tested on AIO works

and second day powered up my gene and instant 00

 

* Looks like removing the glue is bad for our health

[Splave]

^ agreed leave the glue ftw on ihs and cpu

[xxbassplayerxx]

I wonder if the die is smashing with glue off... as @Schmuckley showed, they're extremely easy to shatter.

[Alex@ro]

wish i could do the same but i had shitty IHS+contact:

 

 

So no way i could leave glue on.....

 

I found the proper glue just need to find a method to stick it back with a little bit less presure than socket contact,then wait it try then delid again...

[hotrod717]

After thinking on this all day..... Came home and checked, the first chip i delidded, i had left glue on for some reason. I really scrutinized the recent two chips. Sure enough, both had made direct contact with ihs and the 6700k definititely has crack in it. Both were very promising chips with low voltage. I dont have a lot cash to play with and really, really sucks. Wish I would have seen this thread a couple weeks ago. See If i can scrape together something for a 6320 at least.

Edited March 18, 2016 by hotrod717

[Alex@ro]

what do you mean crack in it?Cracked die ? Don't think socket exercises so much pressure,hmm weird

[hotrod717]

what do you mean crack in it?Cracked die ? Don't think socket exercises so much pressure,hmm weird

Yes, crack in die. upload of pics keeps failing. You can see some abrassion on both dies and 6700k clearly has line perpendicular to any sliding of ihs. I'm testing with a air cooler on top without clamping down, so yeah, just socket and retainer pressure. All that from mounting each chip twice. Edited March 18, 2016 by hotrod717

[Strong Island]

I wonder if the die is smashing with glue off... as @Schmuckley showed, they're extremely easy to shatter.

 

I also think it's the actual process of removing the glue. With the pcb being so thin it twists ever so slightly.

 

after removing glue had 00 on m8e and didnt want to believe it and pushed the start button 3 more times and then mobo would never turn on again..

 

But it does also smash the die. My first chip had really bad marks on the die just from the pressure of ihs on die and not from sliding or anything. One piece of electrical tape on each side was enough to stop that, but it was crazy the marks left in the tape from the ihs, the hold down really squeezes the two together without that glue.

Edited March 18, 2016 by Strong Island

[hotrod717]

I'm taking a chance.. Heating them up with hair dryer and gluing both chips back together with black rtv gasket. If they don't boot.....

That long perpendicular scratch across 6700k is weird. Can't help but think its a crack. The ihs slides forward when clamping. Also the length of it is out of ordinary.

[xxbassplayerxx]

I'm taking a chance.. Heating them up with hair dryer and gluing both chips back together with black rtv gasket. If they don't boot.....

That long perpendicular scratch across 6700k is weird. Can't help but think its a crack. The ihs slides forward when clamping. Also the length of it is out of ordinary.

 

To avoid sliding it forward, loosen the Torx screws, place the chip and close the clamp, then tighten the Torx down.

[der8auer]

You can also just use the Delid Die Mate to glue it back

 

@ Joe: I gave it to dancop on the day I received it. Will check with him

[zeropluszero]

Yeh i just killed my nice 6700K as well. Crack in the die and 00 post code. Not fucking happy.

[xxbassplayerxx]

 

Did you have the glue removed?

[zeropluszero]

no. always left it on.

[GtiJason]

That sucks man, sorry to hear about that. What do you think caused the crack?

[hotrod717]

Both chips continue to be dead. Nothing worse than losing good chips! I think it would be wise to re-glue after replacing the tim in any event. The glue helps to stiffen the pcb. Without it, the pcb can still flex a good bit. So rules for skylake delid -

 

-Use delid tool or razor

-Don't twist pcb

-Don't scrap the glue off

-re-glue after replacing tim

[zeropluszero]

no idea. thats the problem. was working fine, and died at 4.5g on aio cooler in 03 nature. wtf man

[Bruno]

I talked to @Der8auer in Poitiers and told him I will delid my chip, and try to remove the glue and to fill ALL the space between IHS and die with Kryonaut.

Well, I had a crack at -160, warm up and try again. No crack afterwards and benching full pot for 2 hours. Chip is alive and well. So cleaning the glue had no negative impact for me. I used MSI Z170A Xpower.

[zeropluszero]

@der8auer any follow up on these or the proposed upgraded IHS?

If they're tested and available I'd be very keen to grab them off you at Computex.

[Alex@ro]

Here we go folks,the first 99.9% SILVER IHS to be tested. Bigger mass than original ,should be very interesting to see how it goes on cold and silver's reaction to extreme cold compared to copper.

 

Given silver's higher thermal conductivity 406 vs copper 385 i except a few degrees improvement on water, sort of guaranteed,just need to test if on ln2 there will be any gain and hopefully no bigger crack problems.

 

Will update with new thread once it arrives

 

Big thanks for James@Rockitcool !

 

 

[xxbassplayerxx]

Wow. Have the depths been changed to possibly deal with cracking/contact under the IHS?

[websmile]

 

Bling bling...

[der8auer]

Moved the silver IHS in this thread should fit better here.

 

Will be interesting to see if it helps.

 

@ zeropluszero: We didnt manage to get an reliable data yet.